Assignee
SEHO SYSTEMTECHNIK GMBH
DE·6 granted patents·4 pending applications·34 citations·filing 1999–2020
Top patents by PatentIndex Score
10 records- 0161US2021060677A1Soldering nozzle and method for the production thereofSEHO SYSTEMTECHNIK GMBH·Filed 2020·Application pending·0 cites
- 0259US6371354B2Apparatus for the temperature regulation of electronic componentsSEHO SYSTEMTECHNIK GMBH·Filed 2001·Granted Apr 16, 2002·9 cites·4 claims
- 0357US6726087B2Process and device for soldering electrical components on a plastic sheetSEHO SYSTEMTECHNIK GMBH·Filed 2002·Granted Apr 27, 2004·8 cites·5 claims
- 0453US10201866B2Method and soldering device for selective soldering with at least one solder nozzle and another functional element which are moved synchronously by a movement deviceSEHO SYSTEMTECHNIK GMBH·Filed 2013·Granted Feb 12, 2019·1 cites·11 claims
- 0551US7534978B2Process chamber of an installation for the thermal treatment of printed circuit boardsSEHO SYSTEMTECHNIK GMBH·Filed 2003·Granted May 19, 2009·5 cites·3 claims
- 0651US7316308B2Supporting device of a transport device of a soldering apparatusSEHO SYSTEMTECHNIK GMBH·Filed 2006·Granted Jan 8, 2008·4 cites·6 claims
- 0747US2009308912A1Device for the controlled displacement of a spray nozzle to individual spray points, in particular for spraying flux in wave soldering unitsSEHO SYSTEMTECHNIK GMBH·Filed 2007·Application pending·0 cites
- 0844US2008185421A1Process for reflow solderingSEHO SYSTEMTECHNIK GMBH·Filed 2008·Application pending·0 cites
- 0943US2015343546A1Method and device for cleaning a soldering nozzleSEHO SYSTEMTECHNIK GMBH·Filed 2013·Application pending·0 cites
- 1035US6223975B1Method and apparatus for the temperature regulation of components, for example semiconductor circuits, printed circuit boards and the likeSEHO SYSTEMTECHNIK GMBH·Filed 1999·Granted May 1, 2001·7 cites·3 claims
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