Assignee
SAITO HIDEAKI
JP·3 granted patents·3 pending applications·113 citations·filing 2006–2012
Top patents by PatentIndex Score
6 records- 0197US8149906B2Data transfer between chips in a multi-chip semiconductor device with an increased data transfer speedSAITO HIDEAKI·Filed 2008·Granted Apr 3, 2012·106 cites·25 claims
- 0272US8106378B2Semiconductor quantum dot deviceSAITO HIDEAKI·Filed 2006·Granted Jan 31, 2012·3 cites·15 claims
- 0370US8315331B2Transmission method, transmission circuit and transmission systemSAITO HIDEAKI·Filed 2009·Granted Nov 20, 2012·4 cites·2 claims
- 0443US2013098656A1Polyimide resin varnish, and insulated wire, electrical coil, and motor using sameSAITO HIDEAKI·Filed 2012·Application pending·0 cites
- 0542US2013153262A1Polyester imide resin based varnish for low-permittivity coating filmSAITO HIDEAKI·Filed 2011·Application pending·0 cites
- 0630US2012118616A1Negative photosensitive resin composition, polyimide resin film using same, and flexible printed circuit boardSAITO HIDEAKI·Filed 2010·Application pending·0 cites
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