Assignee
SAGA YUJI
JP·6 granted patents·7 pending applications·25 citations·filing 2007–2013
Top patents by PatentIndex Score
13 records- 0191US9090751B2Thermally conductive thermoplastic resin compositions and related applicationsSAGA YUJI·Filed 2010·Granted Jul 28, 2015·22 cites·15 claims
- 0271US8980984B2Thermally conductive polymer compositions and articles made therefromSAGA YUJI·Filed 2010·Granted Mar 17, 2015·2 cites·10 claims
- 0359US8877851B2Graphite filled polyester compositionsSAGA YUJI·Filed 2013·Granted Nov 4, 2014·1 cites·14 claims
- 0458US8293831B2Thermoplastic composition including thermally conductive filler and hyperbranched polyesteramideSAGA YUJI·Filed 2009·Granted Oct 23, 2012·0 cites·10 claims
- 0555US2008026245A1Vibration damping material, structural laminates, and processes for making sameSAGA YUJI·Filed 2007·Application pending·0 cites
- 0654US2008026246A1Vibration damping material of polyamides and mercaptobenzoimidazolesSAGA YUJI·Filed 2007·Application pending·0 cites
- 0753US8715534B2Method for producing composite member of metal member and resin memberSAGA YUJI·Filed 2009·Granted May 6, 2014·0 cites·14 claims
- 0846US2012157600A1Molded thermoplastic articles comprising thermally conductive polymersSAGA YUJI·Filed 2011·Application pending·0 cites
- 0946US2012153217A1Thermally conductive polymeric resin compositionSAGA YUJI·Filed 2011·Application pending·0 cites
- 1044US2009179506A1Encapsulated stator assembly and process for preparation thereofSAGA YUJI·Filed 2008·Application pending·0 cites
- 1143US2012080640A1Thermally conductive resin compositionSAGA YUJI·Filed 2011·Application pending·0 cites
- 1242US2013200297A1Thermally conductive and dimensionally stable liquid crystalline polymer compositionSAGA YUJI·Filed 2011·Application pending·0 cites
- 1341US8127445B2Method for integrating heat transfer members, and an LED deviceSAGA YUJI·Filed 2009·Granted Mar 6, 2012·0 cites·6 claims
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