Assignee
ROGREN PHILIP E
US·2 granted patents·3 pending applications·15 citations·filing 2011–2016
Top patents by PatentIndex Score
5 records- 0191US8525305B1Lead carrier with print-formed package componentsROGREN PHILIP E·Filed 2011·Granted Sep 3, 2013·15 cites·27 claims
- 0246US2013001761A1Lead carrier with thermally fused package componentsROGREN PHILIP E·Filed 2012·Application pending·0 cites
- 0340US8749035B2Lead carrier with multi-material print formed package componentsROGREN PHILIP E·Filed 2012·Granted Jun 10, 2014·0 cites·16 claims
- 0439US2018034038A1Lead carrier structure and packages formed therefrom without die attach padsROGREN PHILIP E·Filed 2016·Application pending·0 cites
- 0533US2018047589A1Lead carrier with print formed package components and conductive path redistribution structuresROGREN PHILIP E·Filed 2016·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →