Assignee
RATHBURN JAMES
US·33 granted patents·1 pending application·878 citations·filing 2010–2020
Top patents by PatentIndex Score
34 records- 0198US8758067B2Selective metalization of electrical connector or socket housingRATHBURN JAMES·Filed 2012·Granted Jun 24, 2014·72 cites·18 claims
- 0297US8988093B2Bumped semiconductor wafer or die level electrical interconnectRATHBURN JAMES·Filed 2012·Granted Mar 24, 2015·36 cites·19 claims
- 0397US8955215B2High performance surface mount electrical interconnectRATHBURN JAMES·Filed 2010·Granted Feb 17, 2015·41 cites·14 claims
- 0497US8803539B2Compliant wafer level probe assemblyRATHBURN JAMES·Filed 2010·Granted Aug 12, 2014·55 cites·29 claims
- 0597US8789272B2Method of making a compliant printed circuit peripheral lead semiconductor test socketRATHBURN JAMES·Filed 2010·Granted Jul 29, 2014·45 cites·17 claims
- 0697US8618649B2Compliant printed circuit semiconductor packageRATHBURN JAMES·Filed 2010·Granted Dec 31, 2013·52 cites·19 claims
- 0797US8610265B2Compliant core peripheral lead semiconductor test socketRATHBURN JAMES·Filed 2012·Granted Dec 17, 2013·51 cites·18 claims
- 0897US8525346B2Compliant conductive nano-particle electrical interconnectRATHBURN JAMES·Filed 2012·Granted Sep 3, 2013·58 cites·21 claims
- 0996US8987886B2Copper pillar full metal via electrical circuit structureRATHBURN JAMES·Filed 2012·Granted Mar 24, 2015·35 cites·12 claims
- 1096US8984748B2Singulated semiconductor device separable electrical interconnectRATHBURN JAMES·Filed 2010·Granted Mar 24, 2015·35 cites·12 claims
- 1196US8981809B2Compliant printed circuit semiconductor tester interfaceRATHBURN JAMES·Filed 2010·Granted Mar 17, 2015·34 cites·17 claims
- 1296US8981568B2Simulated wirebond semiconductor packageRATHBURN JAMES·Filed 2010·Granted Mar 17, 2015·38 cites·20 claims
- 1396US8970031B2Semiconductor die terminalRATHBURN JAMES·Filed 2010·Granted Mar 3, 2015·36 cites·11 claims
- 1496US8955216B2Method of making a compliant printed circuit peripheral lead semiconductor packageRATHBURN JAMES·Filed 2010·Granted Feb 17, 2015·35 cites·13 claims
- 1596US8928344B2Compliant printed circuit socket diagnostic toolRATHBURN JAMES·Filed 2010·Granted Jan 6, 2015·41 cites·19 claims
- 1696US8912812B2Compliant printed circuit wafer probe diagnostic toolRATHBURN JAMES·Filed 2010·Granted Dec 16, 2014·34 cites·21 claims
- 1794US9276339B2Electrical interconnect IC device socketRATHBURN JAMES·Filed 2011·Granted Mar 1, 2016·21 cites·20 claims
- 1892US9276336B2Metalized pad to electrical contact interfaceRATHBURN JAMES·Filed 2012·Granted Mar 1, 2016·14 cites·20 claims
- 1992US9093767B2High performance surface mount electrical interconnectRATHBURN JAMES·Filed 2011·Granted Jul 28, 2015·14 cites·25 claims
- 2091US9277654B2Composite polymer-metal electrical contactsRATHBURN JAMES·Filed 2010·Granted Mar 1, 2016·12 cites·19 claims
- 2191US9196980B2High performance surface mount electrical interconnect with external biased normal force loadingRATHBURN JAMES·Filed 2012·Granted Nov 24, 2015·12 cites·17 claims
- 2291US9136196B2Compliant printed circuit wafer level semiconductor packageRATHBURN JAMES·Filed 2010·Granted Sep 15, 2015·15 cites·16 claims
- 2390US9320133B2Electrical interconnect IC device socketRATHBURN JAMES·Filed 2011·Granted Apr 19, 2016·11 cites·20 claims
- 2490US9184527B2Electrical connector insulator housingRATHBURN JAMES·Filed 2011·Granted Nov 10, 2015·10 cites·15 claims
- 2588US9320144B2Method of forming a semiconductor socketRATHBURN JAMES·Filed 2010·Granted Apr 19, 2016·12 cites·13 claims
- 2688US9054097B2Compliant printed circuit area array semiconductor device packageRATHBURN JAMES·Filed 2010·Granted Jun 9, 2015·10 cites·30 claims
- 2787US9231328B2Resilient conductive electrical interconnectRATHBURN JAMES·Filed 2010·Granted Jan 5, 2016·18 cites·20 claims
- 2886US9184145B2Semiconductor device package adapterRATHBURN JAMES·Filed 2011·Granted Nov 10, 2015·9 cites·22 claims
- 2985US9232654B2High performance electrical circuit structureRATHBURN JAMES·Filed 2011·Granted Jan 5, 2016·8 cites·16 claims
- 3081US9613841B2Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connectionRATHBURN JAMES·Filed 2012·Granted Apr 4, 2017·6 cites·8 claims
- 3179US9603249B2Direct metalization of electrical circuit structuresRATHBURN JAMES·Filed 2012·Granted Mar 21, 2017·5 cites·9 claims
- 3276US9414500B2Compliant printed flexible circuitRATHBURN JAMES·Filed 2010·Granted Aug 9, 2016·3 cites·42 claims
- 3369US12568576B2Stud bumped printed circuit assemblyRATHBURN JAMES·Filed 2020·Granted Mar 3, 2026·0 cites·6 claims
- 3437US2013203273A1High speed backplane connectorRATHBURN JAMES·Filed 2011·Application pending·0 cites
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