Assignee
RAMAKRISHNA KAMBHAMPATI
US·5 granted patents·13 citations·filing 2004–2012
Top patents by PatentIndex Score
5 records- 0172US8178982B2Dual molded multi-chip package systemRAMAKRISHNA KAMBHAMPATI·Filed 2006·Granted May 15, 2012·3 cites·20 claims
- 0271US8106496B2Semiconductor packaging system with stacking and method of manufacturing thereofRAMAKRISHNA KAMBHAMPATI·Filed 2007·Granted Jan 31, 2012·5 cites·26 claims
- 0352US8211753B2Leadframe-based mold array package heat spreader and fabrication method thereforRAMAKRISHNA KAMBHAMPATI·Filed 2004·Granted Jul 3, 2012·5 cites·11 claims
- 0451US8558399B2Dual molded multi-chip package systemRAMAKRISHNA KAMBHAMPATI·Filed 2012·Granted Oct 15, 2013·0 cites·10 claims
- 0549US8581375B2Leadframe-based mold array package heat spreader and fabrication method thereforRAMAKRISHNA KAMBHAMPATI·Filed 2012·Granted Nov 12, 2013·0 cites·11 claims
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