Assignee
PRESSEL KLAUS
DE·3 granted patents·1 pending application·76 citations·filing 2007–2012
Top patents by PatentIndex Score
4 records- 0196US8237259B2Embedded chip packagePRESSEL KLAUS·Filed 2007·Granted Aug 7, 2012·46 cites·16 claims
- 0295US8779583B2Semiconductor device and manufacturing methodPRESSEL KLAUS·Filed 2012·Granted Jul 15, 2014·21 cites·20 claims
- 0385US8338936B2Semiconductor device and manufacturing methodPRESSEL KLAUS·Filed 2008·Granted Dec 25, 2012·9 cites·19 claims
- 0448US2012287583A1Embedded chip packagePRESSEL KLAUS·Filed 2012·Application pending·0 cites
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