Assignee
MORITA TOSHIAKI
JP·2 granted patents·2 pending applications·9 citations·filing 2005–2010
Top patents by PatentIndex Score
4 records- 0171US8513534B2Semiconductor device and bonding materialMORITA TOSHIAKI·Filed 2009·Granted Aug 20, 2013·6 cites·15 claims
- 0268US8592996B2Semiconductor device and method of manufacturing the sameMORITA TOSHIAKI·Filed 2010·Granted Nov 26, 2013·3 cites·19 claims
- 0349US2007169597A1Method and apparatus for adjusting suction of cutting machineMORITA TOSHIAKI·Filed 2005·Application pending·0 cites
- 0435US2005258550A1Circuit board and semiconductor device using the sameMORITA TOSHIAKI·Filed 2005·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →