Assignee
MORISHITA SEIICHI
JP·1 granted patent·1 pending application·0 citations·filing 2006–2006
Top patents by PatentIndex Score
2 records- 0129US2008017408A1Device With Mounted Electronic Parts, Method Of Producing The Same, Protection Circuit Module Of Secondary Battery, And Battery PackageMORISHITA SEIICHI·Filed 2006·Application pending·0 cites
- 0223US8148209B2Resin ejection nozzle, resin encapsulation method, and electronic part assemblyMORISHITA SEIICHI·Filed 2006·Granted Apr 3, 2012·0 cites·5 claims
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