Assignee
MICRON TECHNOLOGIES INC
US·29 granted patents·1,267 citations·filing 1992–2008
Top patents by PatentIndex Score
29 records- 0198US7671459B2Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devicesMICRON TECHNOLOGIES INC·Filed 2006·Granted Mar 2, 2010·161 cites·11 claims
- 0297US7847282B2Vertical tunneling transistorMICRON TECHNOLOGIES INC·Filed 2008·Granted Dec 7, 2010·51 cites·26 claims
- 0396US7601608B2Memory array buried digit lineMICRON TECHNOLOGIES INC·Filed 2006·Granted Oct 13, 2009·29 cites·17 claims
- 0496US6180450B1Semiconductor processing methods of forming stacked capacitorsMICRON TECHNOLOGIES INC·Filed 1999·Granted Jan 30, 2001·127 cites·18 claims
- 0595US6084302ABarrier layer cladding around copper interconnect linesMICRON TECHNOLOGIES INC·Filed 1995·Granted Jul 4, 2000·195 cites·12 claims
- 0694US7517804B2Selective etch chemistries for forming high aspect ratio features and associated structuresMICRON TECHNOLOGIES INC·Filed 2006·Granted Apr 14, 2009·20 cites·16 claims
- 0794US5634974AMethod for forming hemispherical grained siliconMICRON TECHNOLOGIES INC·Filed 1995·Granted Jun 3, 1997·101 cites·74 claims
- 0892US6198168B1Integrated circuits using high aspect ratio vias through a semiconductor wafer and method for forming sameMICRON TECHNOLOGIES INC·Filed 1998·Granted Mar 6, 2001·116 cites·26 claims
- 0990US5196360AMethods for inhibiting outgrowth of silicide in self-aligned silicide processMICRON TECHNOLOGIES INC·Filed 1992·Granted Mar 23, 1993·87 cites·17 claims
- 1087US5698455AMethod for predicting process characteristics of polyurethane padsMICRON TECHNOLOGIES INC·Filed 1995·Granted Dec 16, 1997·54 cites·30 claims
- 1186US5990903AMethod and apparatus for performing chroma key, transparency and fog operationsMICRON TECHNOLOGIES INC·Filed 1997·Granted Nov 23, 1999·95 cites·37 claims
- 1281US5323350AIntegrated circuit memory with dual P-sense amplifiers associated with each column lineMICRON TECHNOLOGIES INC·Filed 1992·Granted Jun 21, 1994·48 cites·9 claims
- 1376US7619669B2Power savings with multiple readout circuitsMICRON TECHNOLOGIES INC·Filed 2003·Granted Nov 17, 2009·12 cites·70 claims
- 1475US7848158B2Methods and apparatuses for programming flash memory using modulated pulsesMICRON TECHNOLOGIES INC·Filed 2008·Granted Dec 7, 2010·9 cites·17 claims
- 1575US5756404ATwo-step nitride depositionMICRON TECHNOLOGIES INC·Filed 1995·Granted May 26, 1998·59 cites·17 claims
- 1670US7622769B2Isolation trenchMICRON TECHNOLOGIES INC·Filed 2006·Granted Nov 24, 2009·3 cites·10 claims
- 1770US5956611AField emission displays with reduced light leakageMICRON TECHNOLOGIES INC·Filed 1997·Granted Sep 21, 1999·14 cites·6 claims
- 1865US5901194ATimer circuit with programmable decode circuitryMICRON TECHNOLOGIES INC·Filed 1997·Granted May 4, 1999·16 cites·16 claims
- 1963US7253076B1Methods for forming and integrated circuit structures containing ruthenium and tungsten containing layersMICRON TECHNOLOGIES INC·Filed 2000·Granted Aug 7, 2007·5 cites·26 claims
- 2062US6664632B2Utilization of die active surfaces for laterally extending die internal and external connectionsMICRON TECHNOLOGIES INC·Filed 2003·Granted Dec 16, 2003·6 cites·30 claims
- 2160US7157387B2Techniques to create low K ILD for BEOLMICRON TECHNOLOGIES INC·Filed 2004·Granted Jan 2, 2007·4 cites·31 claims
- 2258US6069832AMethod for multiple staged power up of integrated circuitMICRON TECHNOLOGIES INC·Filed 1997·Granted May 30, 2000·14 cites·17 claims
- 2357US7102191B2Memory device with high dielectric constant gate dielectrics and metal floating gatesMICRON TECHNOLOGIES INC·Filed 2004·Granted Sep 5, 2006·4 cites·5 claims
- 2454US6541390B2Method and composition for selectively etching against cobalt silicideMICRON TECHNOLOGIES INC·Filed 2001·Granted Apr 1, 2003·2 cites·48 claims
- 2552US5898625AFast power up reference voltage circuit and methodMICRON TECHNOLOGIES INC·Filed 1997·Granted Apr 27, 1999·12 cites·37 claims
- 2650US5923040AWafer sample retainer for an electron microscopeMICRON TECHNOLOGIES INC·Filed 1997·Granted Jul 13, 1999·10 cites·6 claims
- 2749US7485565B2Nickel bonding cap over copper metalized bondpadsMICRON TECHNOLOGIES INC·Filed 2006·Granted Feb 3, 2009·0 cites·20 claims
- 2848US7851266B2Microelectronic device wafers including an in-situ molded adhesive, molds for in-situ molding adhesives on microelectronic device wafers, and methods of molding adhesives on microelectronic device wafersMICRON TECHNOLOGIES INC·Filed 2008·Granted Dec 14, 2010·0 cites·9 claims
- 2946US6061510ALocal bus interfaceMICRON TECHNOLOGIES INC·Filed 1998·Granted May 9, 2000·13 cites·10 claims
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