Assignee
LUAN JING-EN
SG·8 granted patents·36 citations·filing 2008–2012
Top patents by PatentIndex Score
8 records- 0194US8890269B2Optical sensor package with through viasLUAN JING-EN·Filed 2012·Granted Nov 18, 2014·14 cites·17 claims
- 0291US8934052B2Camera module including an image sensor and a laterally adjacent surface mount device coupled at a lower surface of a dielectric material layerLUAN JING-EN·Filed 2010·Granted Jan 13, 2015·14 cites·13 claims
- 0381US8502367B2Wafer-level packaging method using composite material as a baseLUAN JING-EN·Filed 2010·Granted Aug 6, 2013·6 cites·18 claims
- 0460US9019636B2Lens alignment apparatus and methodLUAN JING-EN·Filed 2010·Granted Apr 28, 2015·1 cites·24 claims
- 0555US9640574B2Image sensor circuit, system, and methodLUAN JING-EN·Filed 2011·Granted May 2, 2017·1 cites·4 claims
- 0651US8278146B2Manufacturing method of chip package with coplanarity controlling featureLUAN JING-EN·Filed 2008·Granted Oct 2, 2012·0 cites·13 claims
- 0749US8836143B2Chip package with coplanarity controlling featureLUAN JING-EN·Filed 2012·Granted Sep 16, 2014·0 cites·19 claims
- 0846US9025339B2Adhesive damLUAN JING-EN·Filed 2011·Granted May 5, 2015·0 cites·18 claims
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