Assignee
LOU WEI-CHENG
TW·0 granted patents·3 pending applications·0 citations·filing 2011–2012
Top patents by PatentIndex Score
3 records- 0136US2012318850A1Chip bonding apparatusLOU WEI-CHENG·Filed 2011·Application pending·0 cites
- 0235US2013105852A1Package structure and manufacturing method for the sameLOU WEI-CHENG·Filed 2012·Application pending·0 cites
- 0331US2012318851A1Chip bonding processLOU WEI-CHENG·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →