Assignee
LIU CHENGLIN
US·7 granted patents·2 pending applications·22 citations·filing 2007–2012
Top patents by PatentIndex Score
9 records- 0191US8673687B1Etched hybrid die packageLIU CHENGLIN·Filed 2010·Granted Mar 18, 2014·12 cites·19 claims
- 0282US8218261B1Thermal solution for drive systems such as hard disk drives and digital versatile discsLIU CHENGLIN·Filed 2011·Granted Jul 10, 2012·3 cites·10 claims
- 0374US8518742B1Semiconductor packaging with internal wiring busLIU CHENGLIN·Filed 2011·Granted Aug 27, 2013·3 cites·10 claims
- 0472US9064784B1Ball grid array package with laser vias and methods for making the sameLIU CHENGLIN·Filed 2010·Granted Jun 23, 2015·4 cites·10 claims
- 0553US8900932B2Thermal enhanced packageLIU CHENGLIN·Filed 2012·Granted Dec 2, 2014·0 cites·21 claims
- 0652US8294248B2Chip on leadsLIU CHENGLIN·Filed 2007·Granted Oct 23, 2012·0 cites·13 claims
- 0741US9123699B1Formation of package pins in semiconductor packagingLIU CHENGLIN·Filed 2011·Granted Sep 1, 2015·0 cites·9 claims
- 0837US2010283143A1Die Exposed Chip PackageLIU CHENGLIN·Filed 2010·Application pending·0 cites
- 0931US2011012240A1Multi-Connect LeadLIU CHENGLIN·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when LIU CHENGLIN files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →