Assignee
KATO HIROMASA
JP·3 granted patents·25 citations·filing 2007–2012
Top patents by PatentIndex Score
3 records- 0189US8273993B2Electronic component moduleKATO HIROMASA·Filed 2007·Granted Sep 25, 2012·19 cites·11 claims
- 0281US8785785B2Ceramic circuit board and process for producing sameKATO HIROMASA·Filed 2012·Granted Jul 22, 2014·6 cites·20 claims
- 0349US9214617B2Electronic component moduleKATO HIROMASA·Filed 2012·Granted Dec 15, 2015·0 cites·9 claims
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