Assignee
KAO HUAHUNG
US·3 granted patents·25 citations·filing 2010–2012
Top patents by PatentIndex Score
3 records- 0191US9209163B2Package-on-package structuresKAO HUAHUNG·Filed 2012·Granted Dec 8, 2015·13 cites·19 claims
- 0280US8686547B1Stack die structure for stress reduction and facilitation of electromagnetic shieldingKAO HUAHUNG·Filed 2011·Granted Apr 1, 2014·7 cites·20 claims
- 0377US9355951B2Interconnect layouts for electronic assembliesKAO HUAHUNG·Filed 2010·Granted May 31, 2016·5 cites·3 claims
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