Assignee
KAO CHUNG-YAO
TW·1 granted patent·2 pending applications·0 citations·filing 2010–2011
Top patents by PatentIndex Score
3 records- 0133US8212368B2Semiconductor package and manufacturing method thereof and encapsulating method thereofKAO CHUNG-YAO·Filed 2011·Granted Jul 3, 2012·0 cites·20 claims
- 0223US2012025369A1Semiconductor packageKAO CHUNG-YAO·Filed 2010·Application pending·0 cites
- 0319US2012032351A1Semiconductor packageKAO CHUNG-YAO·Filed 2010·Application pending·0 cites
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