Assignee
KAMO HIROSHI
JP·3 granted patents·1 citations·filing 2005–2010
Top patents by PatentIndex Score
3 records- 0167US8124694B2Mold releasing film for printed circuit board productionKAMO HIROSHI·Filed 2009·Granted Feb 28, 2012·1 cites·4 claims
- 0245US8691898B2Resin compositionKAMO HIROSHI·Filed 2005·Granted Apr 8, 2014·0 cites·18 claims
- 0342US8916633B2TAB leader tape made of polyphenylene ether-based resinKAMO HIROSHI·Filed 2010·Granted Dec 23, 2014·0 cites·5 claims
Join the waitlist — get patent alerts
Get an alert when KAMO HIROSHI files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →