Assignee
JI BONG-KI
0 granted patents·2 pending applications·0 citations·filing 2005–2005
Top patents by PatentIndex Score
2 records- 0138US2008274896A1Substrate for Superconducting Wire and Fabrication Method Thereof and Superconducting WireJI BONG-KI·Filed 2005·Application pending·0 cites
- 0232US2007191232A1Superconductor Wire Material Having Structure For Inhibiting Crack, Superconductor Power Cable Using The Same And Manufacturing Method ThereofJI BONG-KI·Filed 2005·Application pending·0 cites
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