Assignee
JENG SHIN-PUU
TW·9 granted patents·1 pending application·220 citations·filing 2007–2012
Top patents by PatentIndex Score
10 records- 0198US8519537B23D semiconductor package interposer with die cavityJENG SHIN-PUU·Filed 2010·Granted Aug 27, 2013·81 cites·19 claims
- 0295US8125052B2Seal ring structure with improved cracking protectionJENG SHIN-PUU·Filed 2007·Granted Feb 28, 2012·42 cites·18 claims
- 0395US8058151B2Methods of die sawingJENG SHIN-PUU·Filed 2010·Granted Nov 15, 2011·18 cites·11 claims
- 0494US8558229B2Passivation layer for packaged chipJENG SHIN-PUU·Filed 2011·Granted Oct 15, 2013·19 cites·20 claims
- 0594US8334582B2Protective seal ring for preventing die-saw induced stressJENG SHIN-PUU·Filed 2008·Granted Dec 18, 2012·39 cites·20 claims
- 0686US10475759B2Integrated circuit structure having dies with connectors of different sizesJENG SHIN PUU·Filed 2011·Granted Nov 12, 2019·7 cites·20 claims
- 0780US8178980B2Bond pad structureJENG SHIN-PUU·Filed 2008·Granted May 15, 2012·7 cites·19 claims
- 0875US8643147B2Seal ring structure with improved cracking protection and reduced problemsJENG SHIN-PUU·Filed 2007·Granted Feb 4, 2014·6 cites·13 claims
- 0964US8981580B2Bond pad structureJENG SHIN-PUU·Filed 2012·Granted Mar 17, 2015·1 cites·15 claims
- 1051US2009032945A1Solder bump on a semiconductor substrateJENG SHIN-PUU·Filed 2008·Application pending·0 cites
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