Assignee
INVENT AND COLLABORATION LABORATORY INC
TW·5 granted patents·32 pending applications·9 citations·filing 2023–2025
Top patents by PatentIndex Score
37 records- 0197US12224225B2Semiconductor circuit structure with direct die heat removal structureINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Granted Feb 11, 2025·8 cites·20 claims
- 0293US2025379117A1Semiconductor circuit structure with direct die heat removal structureINVENT AND COLLABORATION LABORATORY INC·Filed 2025·Application pending·0 cites
- 0390US12381123B2Semiconductor circuit structure with direct die heat removal structureINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Granted Aug 5, 2025·1 cites·14 claims
- 0489US12341076B2Semiconductor circuit structure with direct die heat removal structureINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Granted Jun 24, 2025·0 cites·24 claims
- 0589US12341077B2Semiconductor circuit structure with direct die heat removal structureINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Granted Jun 24, 2025·0 cites·13 claims
- 0686US12512387B2Semiconductor circuit structure with direct die heat removal structureINVENT AND COLLABORATION LABORATORY INC·Filed 2025·Granted Dec 30, 2025·0 cites·18 claims
- 0784US2025006584A1Semiconductor circuit structure with direct die heat removal structureINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Application pending·0 cites
- 0880US2025391730A1Semiconductor device structure with efficient heat-removal structures across the chip and monolithic fabrication method thereforINVENT AND COLLABORATION LABORATORY INC·Filed 2025·Application pending·0 cites
- 0979US2025391734A1Semiconductor circuit structure and method for forming the sameINVENT AND COLLABORATION LABORATORY INC·Filed 2025·Application pending·0 cites
- 1073US2025336761A1Semiconductor circuit structure with composite shallow trench isolation region for heat dissipation and method for forming the sameINVENT AND COLLABORATION LABORATORY INC·Filed 2025·Application pending·0 cites
- 1170US2025125211A1Semiconductor device structure with efficient heat-removal structures across the chip and monolithic fabrication method thereforINVENT AND COLLABORATION LABORATORY INC·Filed 2023·Application pending·0 cites
- 1269US2025336760A1Semiconductor circuit structure and method for forming the sameINVENT AND COLLABORATION LABORATORY INC·Filed 2025·Application pending·0 cites
- 1367US2025338493A1Semiconductor circuit structure with composite shallow trench isolation region for heat dissipation and method for forming the sameINVENT AND COLLABORATION LABORATORY INC·Filed 2025·Application pending·0 cites
- 1467US2026045295A1Logic semiconductor die with multiple level caches operated at different voltagesINVENT AND COLLABORATION LABORATORY INC·Filed 2025·Application pending·0 cites
- 1566US2025203838A1Semiconductor cell structureINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Application pending·0 cites
- 1663US2025149375A1Semiconductor device structure with vertical transistor over underground bit lineINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Application pending·0 cites
- 1763US2025107242A1Semiconductor structure and method for forming the sameINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Application pending·0 cites
- 1862US2025098297A1Composite semiconductor substrateINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Application pending·0 cites
- 1962US2025380483A1Transistor structure and method for forming the sameINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Application pending·0 cites
- 2062US2025280556A1Method for forming mos transistor structureINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Application pending·0 cites
- 2161US2024397709A1Integrated circuitINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Application pending·0 cites
- 2261US2025006744A1Semiconductor structureINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Application pending·0 cites
- 2360US2024395668A1Memory array circuitINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Application pending·0 cites
- 2460US2025015187A1Transistor structure with multiple vertical thin bodiesINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Application pending·0 cites
- 2560US2025266359A1Semiconductor circuit structureINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Application pending·0 cites
- 2659US2024298439A1Planar complementary mosfet structure to reduce leakages and planar areasINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Application pending·0 cites
- 2759US2026006865A1Transistor structure with multiple vertical thin bodiesINVENT AND COLLABORATION LABORATORY INC·Filed 2025·Application pending·0 cites
- 2859US2024304672A1Transistor structure with multiple vertical thin bodiesINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Application pending·0 cites
- 2958US2024413159A1Complementary metal-oxide-semiconductor circuitINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Application pending·0 cites
- 3058US2024304624A1metal-oxide-semiconductor transistor and complementary metal-oxide-semiconductor circuit relatedINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Application pending·0 cites
- 3158US2025125210A1Semiconductor device structure with efficient heat-removal structures across the chip and monolithic fabrication method thereforINVENT AND COLLABORATION LABORATORY INC·Filed 2023·Application pending·0 cites
- 3258US2024213348A1Planar complementary mosfet structure to reduce leakages and planar areasINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Application pending·0 cites
- 3357US2024363638A1Semiconductor circuit structure with underground interconnect (ugi) for power delivery, power mesh, and signal deliveryINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Application pending·0 cites
- 3454US2024221827A1Cmos sram structure with bulk nmos transistors and fully insulated pmos transistors in one bulk waferINVENT AND COLLABORATION LABORATORY INC·Filed 2023·Application pending·0 cites
- 3554US2024282861A1Transistor structure with multiple vertical thin bodiesINVENT AND COLLABORATION LABORATORY INC·Filed 2023·Application pending·0 cites
- 3653US2025104763A1Dynamic random-access memory structure with high speed and wide busINVENT AND COLLABORATION LABORATORY INC·Filed 2024·Application pending·0 cites
- 3749US2025266353A1Semiconductor device structures and methods for forming the sameINVENT AND COLLABORATION LABORATORY INC·Filed 2025·Application pending·0 cites
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