Assignee
IIZUKA MINORU
JP·2 granted patents·8 citations·filing 2008–2011
Top patents by PatentIndex Score
2 records- 0168US8279610B2Electronic component package, base of electronic component package, and junction structure of electronic component package and circuit substrateIIZUKA MINORU·Filed 2008·Granted Oct 2, 2012·6 cites·22 claims
- 0257US8796558B2Base of surface-mount electronic component package, and surface-mount electronic component packageIIZUKA MINORU·Filed 2011·Granted Aug 5, 2014·2 cites·11 claims
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