Assignee
HUISINGA TORSTEN
DE·5 granted patents·2 pending applications·26 citations·filing 2010–2012
Top patents by PatentIndex Score
7 records- 0187US8598714B2Semiconductor device comprising through hole vias having a stress relaxation mechanismHUISINGA TORSTEN·Filed 2010·Granted Dec 3, 2013·11 cites·21 claims
- 0285US8399335B2Sophisticated metallization systems in semiconductors formed by removing damaged dielectric layers after forming the metal featuresHUISINGA TORSTEN·Filed 2010·Granted Mar 19, 2013·9 cites·18 claims
- 0375US8786088B2Semiconductor device including ultra low-K (ULK) metallization stacks with reduced chip-package interactionHUISINGA TORSTEN·Filed 2010·Granted Jul 22, 2014·4 cites·12 claims
- 0467US8859418B2Methods of forming conductive structures using a dual metal hard mask techniqueHUISINGA TORSTEN·Filed 2012·Granted Oct 14, 2014·2 cites·16 claims
- 0540US8673770B2Methods of forming conductive structures in dielectric layers on an integrated circuit deviceHUISINGA TORSTEN·Filed 2011·Granted Mar 18, 2014·0 cites·22 claims
- 0638US2012235304A1Ultraviolet (uv)-reflecting film for beol processingHUISINGA TORSTEN·Filed 2011·Application pending·0 cites
- 0737US2013108779A1Methods of Filling Voids in Copper StructuresHUISINGA TORSTEN·Filed 2011·Application pending·0 cites
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