Assignee
HSU CHIH-MING
2 granted patents·21 pending applications·25 citations·filing 2004–2015
Top patents by PatentIndex Score
23 records- 0169USD628303SSole massage machineHSU CHIH-MING·Filed 2010·Granted Nov 30, 2010·17 cites·1 claims
- 0258US2010069800A1Massage deviceHSU CHIH-MING·Filed 2009·Application pending·0 cites
- 0354US2007111479A1High-power-laser chip-fabrication apparatus and method thereofHSU CHIH-MING·Filed 2007·Application pending·0 cites
- 0454US2007190750A1Laser dicing apparatus for a gallium arsenide wafer and method thereofHSU CHIH-MING·Filed 2007·Application pending·0 cites
- 0551USD573672SStomach exercise machineHSU CHIH MING·Filed 2007·Granted Jul 22, 2008·8 cites·1 claims
- 0651US2006124611A1High-power-laser chip-fabrication apparatus and method thereofHSU CHIH-MING·Filed 2005·Application pending·0 cites
- 0751US2008261789A1Rotatable Swissball AB TrainerHSU CHIH-MING·Filed 2007·Application pending·0 cites
- 0850US2006178252A1Top plate for paper pallet and method for making sameHSU CHIH-MING·Filed 2005·Application pending·0 cites
- 0948US2007084838A1Method and cutting system for cutting a wafer by laser using a vacuum working tableHSU CHIH-MING·Filed 2006·Application pending·0 cites
- 1045US2006128120A1Short-wavelength laser dicing apparatus for a diamond wafer and dicing method thereofHSU CHIH-MING·Filed 2005·Application pending·0 cites
- 1145US2006124617A1High-power solid-state laser dicing apparatus for a gallium nitride wafer and dicing method thereofHSU CHIH-MING·Filed 2005·Application pending·0 cites
- 1245US2006124616A1Laser dicing apparatus for a silicon wafer and dicing method thereofHSU CHIH-MING·Filed 2005·Application pending·0 cites
- 1343US2016095466A1Fresh-brewed cold beverage dispensing machineHSU CHIH-MING·Filed 2015·Application pending·0 cites
- 1442US2006003587A1Grinding method for a sapphire waferHSU CHIH-MING·Filed 2005·Application pending·0 cites
- 1541US2013215036A1Keyboard deviceHSU CHIH-MING·Filed 2012·Application pending·0 cites
- 1640US2007032176A1Method for polishing diamond wafersHSU CHIH-MING·Filed 2005·Application pending·0 cites
- 1740US2006138683A1Fabrication method of light emitting diodesHSU CHIH-MING·Filed 2005·Application pending·0 cites
- 1839US2005287833A1Light-emitting-diode structure and fabrication method thereofHSU CHIH-MING·Filed 2005·Application pending·0 cites
- 1939US2006121698A1Plastic film and heat-dissipating ring for chip cuttingHSU CHIH-MING·Filed 2004·Application pending·0 cites
- 2039US2006118530A1Method and apparatus for cutting a chip by laserHSU CHIH-MING·Filed 2004·Application pending·0 cites
- 2138US2005247859A1Package structure of a stack-type light-sensing element and package method thereofHSU CHIH-MING·Filed 2005·Application pending·0 cites
- 2238US2006131010A1Heat dissipating assembly for a heat elementHSU CHIH-MING·Filed 2005·Application pending·0 cites
- 2335US2014314396A1Electrothermal elementHSU CHIH-MING·Filed 2013·Application pending·0 cites
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