Assignee
HOEFFLIN FRANK
US·3 granted patents·4 pending applications·22 citations·filing 2006–2010
Top patents by PatentIndex Score
7 records- 0183US8545956B2Expandable insert with flexible substrateHOEFFLIN FRANK·Filed 2010·Granted Oct 1, 2013·11 cites·23 claims
- 0278US8133929B2Method for incorporating long glass fibers into epoxy-based reinforcing resinsHOEFFLIN FRANK·Filed 2008·Granted Mar 13, 2012·10 cites·11 claims
- 0362US8163380B2Damping composition with improved bakabilityHOEFFLIN FRANK·Filed 2007·Granted Apr 24, 2012·1 cites·36 claims
- 0462US2009023824A1Thermally expansible material substantially free of tackifierHOEFFLIN FRANK·Filed 2008·Application pending·0 cites
- 0555US2007110951A1Thermally expansible material substantially free of tackifierHOEFFLIN FRANK·Filed 2006·Application pending·0 cites
- 0646US2009017216A1Resin blends with wide temperature range dampingHOEFFLIN FRANK·Filed 2008·Application pending·0 cites
- 0744US2007281095A1Constrained layer damperHOEFFLIN FRANK·Filed 2007·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →