Assignee

HO YA-TING

TW·1 granted patent·1 pending application·0 citations·filing 2008–2009

Technology mixG02F1 G09F1 H05K1 Y10T1

Top patents by PatentIndex Score

2 records

0143US2008209717A1Thermal bonding structure and manufacture process of flexible printed circuit boardHO YA-TING·Filed 2008·Application pending·0 cites
0238US8446546B2Backlight module with bent reflector sheet and display panel deviceHO YA-TING·Filed 2009·Granted May 21, 2013·0 cites·16 claims

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