Assignee
HIRAKAWA OSAMU
JP·5 granted patents·3 pending applications·6 citations·filing 2010–2012
Top patents by PatentIndex Score
8 records- 0168US8490856B2Joint apparatus, joint method, and computer storage mediumHIRAKAWA OSAMU·Filed 2010·Granted Jul 23, 2013·2 cites·9 claims
- 0267US9919509B2Peeling device, peeling system and peeling methodHIRAKAWA OSAMU·Filed 2011·Granted Mar 20, 2018·2 cites·17 claims
- 0364US9330898B2Separation system, separation method, program and computer storage mediumHIRAKAWA OSAMU·Filed 2011·Granted May 3, 2016·2 cites·7 claims
- 0440US9827756B2Separation apparatus, separation system, and separation methodHIRAKAWA OSAMU·Filed 2012·Granted Nov 28, 2017·0 cites·24 claims
- 0538US9956755B2Separation method, separation apparatus, and separation systemHIRAKAWA OSAMU·Filed 2012·Granted May 1, 2018·0 cites·18 claims
- 0637US2014158303A1Bonding system, substrate processing system, and bonding methodHIRAKAWA OSAMU·Filed 2012·Application pending·0 cites
- 0737US2012329000A1Substrate processing apparatus, substrate processing method, program and computer storage mediumHIRAKAWA OSAMU·Filed 2011·Application pending·0 cites
- 0834US2013153116A1Joint system, substrate processing system, and joint methodHIRAKAWA OSAMU·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →