Assignee
HIGHCON SYSTEMS LTD
IL·16 granted patents·5 pending applications·23 citations·filing 2012–2024
Top patents by PatentIndex Score
21 records- 0193US10427248B2Cardboard-handling system and methodHIGHCON SYSTEMS LTD·Filed 2016·Granted Oct 1, 2019·5 cites·20 claims
- 0287US2025326928A1Method and system for creating co-layer surface adhesive ruleHIGHCON SYSTEMS LTD·Filed 2024·Application pending·0 cites
- 0384US11059253B2Method and system for cardboard pretreatmentHIGHCON SYSTEMS LTD·Filed 2013·Granted Jul 13, 2021·6 cites·6 claims
- 0481US12202972B2Method and system for creating co-layer surface adhesive ruleHIGHCON SYSTEMS LTD·Filed 2022·Granted Jan 21, 2025·0 cites·23 claims
- 0580US9492984B2Systems and methods for treating and handling cardboard sheetsHIGHCON SYSTEMS LTD·Filed 2014·Granted Nov 15, 2016·8 cites·20 claims
- 0674US12552125B2Method and system for cardboard pretreatmentHIGHCON SYSTEMS LTD·Filed 2021·Granted Feb 17, 2026·0 cites·9 claims
- 0772US9436012B2Method and apparatus for laser cuttingHIGHCON SYSTEMS LTD·Filed 2013·Granted Sep 6, 2016·3 cites·48 claims
- 0868US9346129B2Cardboard-handling system and methodHIGHCON SYSTEMS LTD·Filed 2012·Granted May 24, 2016·1 cites·27 claims
- 0965US11780108B2Method and apparatus for substrate strippingHIGHCON SYSTEMS LTD·Filed 2021·Granted Oct 10, 2023·0 cites·17 claims
- 1065US11130307B2Polymeric rule die, and formulations thereforHIGHCON SYSTEMS LTD·Filed 2020·Granted Sep 28, 2021·0 cites·19 claims
- 1162US11447631B2Method and system for creating co-layer surface adhesive ruleHIGHCON SYSTEMS LTD·Filed 2014·Granted Sep 20, 2022·0 cites·22 claims
- 1262US2023212824A1Method and apparatus for conditioning of cardboardHIGHCON SYSTEMS LTD·Filed 2023·Application pending·0 cites
- 1357US11858776B2Sheet conveying apparatusHIGHCON SYSTEMS LTD·Filed 2021·Granted Jan 2, 2024·0 cites·19 claims
- 1453US2017203458A1Method and apparatus for substrate strippingHIGHCON SYSTEMS LTD·Filed 2015·Application pending·0 cites
- 1551US12194509B2System and method for cleaning a laser cut substrateHIGHCON SYSTEMS LTD·Filed 2019·Granted Jan 14, 2025·0 cites·24 claims
- 1649US10625485B2Polymeric rule die, and formulations thereforHIGHCON SYSTEMS LTD·Filed 2015·Granted Apr 21, 2020·0 cites·14 claims
- 1745US2019358883A1Multi-orifice nozzle and uses thereofHIGHCON SYSTEMS LTD·Filed 2019·Application pending·0 cites
- 1844US11667099B2System for creating a relief pattern on a substrateHIGHCON SYSTEMS LTD·Filed 2017·Granted Jun 6, 2023·0 cites·20 claims
- 1944US2019134934A1System and method for forming a fold line in a substrateHIGHCON SYSTEMS LTD·Filed 2017·Application pending·0 cites
- 2042US11135803B2System for impressing a relief pattern on a substrateHIGHCON SYSTEMS LTD·Filed 2017·Granted Oct 5, 2021·0 cites·18 claims
- 2142US10556415B2Method and apparatus for building a 3D object from layers of pre-stripped substrateHIGHCON SYSTEMS LTD·Filed 2015·Granted Feb 11, 2020·0 cites·20 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →