Assignee
HAYASHISHITA EIJI
JP·2 granted patents·5 citations·filing 2011–2011
Top patents by PatentIndex Score
2 records- 0174US8728910B2Expandable film, dicing film, and method of producing semiconductor deviceHAYASHISHITA EIJI·Filed 2011·Granted May 20, 2014·5 cites·12 claims
- 0238US8476740B2Sheet for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using sheetHAYASHISHITA EIJI·Filed 2011·Granted Jul 2, 2013·0 cites·15 claims
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