Assignee

HARVATEK CORPORTION

TW·1 granted patent·6 citations·filing 2008–2008

Technology mixF21K1 H05K1 H10H1 H10W1

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0168US8002436B2LED chip package structure using a substrate as a lampshade and method for making the sameHARVATEK CORPORTION·Filed 2008·Granted Aug 23, 2011·6 cites·6 claims

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