Assignee
ENG MEOW KOON
SG·3 granted patents·8 citations·filing 2010–2012
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0179US8198720B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsENG MEOW KOON·Filed 2010·Granted Jun 12, 2012·3 cites·11 claims
- 0277US8525320B2Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methodsENG MEOW KOON·Filed 2011·Granted Sep 3, 2013·4 cites·18 claims
- 0369US8536702B2Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methodsENG MEOW KOON·Filed 2012·Granted Sep 17, 2013·1 cites·13 claims
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