Assignee
EKC TECH INC
US·6 granted patents·4 pending applications·3 citations·filing 2013–2025
Top patents by PatentIndex Score
10 records- 0180US10155921B2Removal composition for selectively removing hard mask and methods thereofEKC TECH INC·Filed 2014·Granted Dec 18, 2018·3 cites·20 claims
- 0278US2025188302A1Metal nanowire ink for the formation of transparent conductive films with fused networksEKC TECH INC·Filed 2025·Application pending·0 cites
- 0374US2025250446A1Transparent films with control of light hue using nanoscale colorantsEKC TECH INC·Filed 2025·Application pending·0 cites
- 0471US12394536B2Silver nanowire and noble-metal coated silver nanowire conductive polymer composites with low loading percolation conductionEKC TECH INC·Filed 2023·Granted Aug 19, 2025·0 cites·22 claims
- 0570US12584025B2High loadings of silver nanowires: dispersions and pastes; conductive materials; and corresponding methodsEKC TECH INC·Filed 2024·Granted Mar 24, 2026·0 cites·15 claims
- 0670US12568783B2Silver-based transparent conductive layers interfaced with copper traces and methods for forming the structuresEKC TECH INC·Filed 2022·Granted Mar 3, 2026·0 cites·20 claims
- 0761US2025257234A1Conductive composites, inks and adhesives with low silver nanowire loading and low resistivity, and methods for forming conductive featuresEKC TECH INC·Filed 2025·Application pending·0 cites
- 0857US2016240368A1Method and composition for selectively removing metal hardmask and other residues from semiconductor device substrates comprising low-k dielectric material and copperEKC TECH INC·Filed 2014·Application pending·0 cites
- 0952US12407349B2Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networksEKC TECH INC·Filed 2018·Granted Sep 2, 2025·0 cites·20 claims
- 1050US9481855B2Cleaning composition and method for cleaning a semiconductor device substrate after chemical mechanical polishingEKC TECH INC·Filed 2013·Granted Nov 1, 2016·0 cites·4 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →