Assignee
EGBON ELECTRONICS LTD
TW·15 granted patents·3 pending applications·311 citations·filing 2002–2005
Top patents by PatentIndex Score
18 records- 0194US7134896B1Latch of a card edge connectorEGBON ELECTRONICS LTD·Filed 2005·Granted Nov 14, 2006·51 cites·16 claims
- 0289US6749450B1Socket for a memory cardEGBON ELECTRONICS LTD·Filed 2003·Granted Jun 15, 2004·53 cites·7 claims
- 0387US6910917B2Electric connector combinationEGBON ELECTRONICS LTD·Filed 2003·Granted Jun 28, 2005·44 cites·6 claims
- 0482US6695630B1Connector assembly for a memory moduleEGBON ELECTRONICS LTD·Filed 2002·Granted Feb 24, 2004·38 cites·20 claims
- 0581US7140886B1Contact terminal structureEGBON ELECTRONICS LTD·Filed 2005·Granted Nov 28, 2006·10 cites·1 claims
- 0671US6672888B1Clamp assembly for an advanced graphic port (AGP) display interface cardEGBON ELECTRONICS LTD·Filed 2002·Granted Jan 6, 2004·23 cites·3 claims
- 0769US7182124B2Heat sink structureEGBON ELECTRONICS LTD·Filed 2004·Granted Feb 27, 2007·15 cites·3 claims
- 0869US6863570B2Memory card connectorEGBON ELECTRONICS LTD·Filed 2003·Granted Mar 8, 2005·14 cites·6 claims
- 0968US6997728B1Card edge connectorEGBON ELECTRONICS LTD·Filed 2005·Granted Feb 14, 2006·11 cites·8 claims
- 1068US6705883B1Electrical connector for connecting CPU to main boardEGBON ELECTRONICS LTD·Filed 2002·Granted Mar 16, 2004·20 cites·1 claims
- 1161US6736660B2Memory module connector for horizontal insertionEGBON ELECTRONICS LTD·Filed 2002·Granted May 18, 2004·15 cites·3 claims
- 1258US7219504B2Heat dissipation system with an air compressing mechanismEGBON ELECTRONICS LTD·Filed 2005·Granted May 22, 2007·1 cites·4 claims
- 1351US6960093B1Interface card connectorEGBON ELECTRONICS LTD·Filed 2004·Granted Nov 1, 2005·11 cites·9 claims
- 1450US7001186B1Jig for orientating a CPUEGBON ELECTRONICS LTD·Filed 2005·Granted Feb 21, 2006·3 cites·9 claims
- 1547US7168622B2Card edge connectorEGBON ELECTRONICS LTD·Filed 2005·Granted Jan 30, 2007·2 cites·9 claims
- 1645US2006090873A1Method for manufacturing heat sink devicesEGBON ELECTRONICS LTD·Filed 2004·Application pending·0 cites
- 1745US2006039116A1Heat-sinking base plate and its manufacturing methodEGBON ELECTRONICS LTD·Filed 2004·Application pending·0 cites
- 1840US2006175046A1Heat dispensing deviceEGBON ELECTRONICS LTD·Filed 2005·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →