Assignee
DUH JENQ-GONG
0 granted patents·7 pending applications·0 citations·filing 2009–2011
Top patents by PatentIndex Score
7 records- 0138US2012308880A1Porous li4ti5o12 anode material, method of manufacturing the same and battery comprising the sameDUH JENQ GONG·Filed 2011·Application pending·0 cites
- 0237US2010244266A1Metallic bonding structure for copper and solderDUH JENQ-GONG·Filed 2009·Application pending·0 cites
- 0331US2011109415A1Inductor structureDUH JENQ-GONG·Filed 2009·Application pending·0 cites
- 0431US2010277880A1Electronic package structureDUH JENQ-GONG·Filed 2009·Application pending·0 cites
- 0527US2011281136A1Copper-manganese bonding structure for electronic packagesDUH JENQ-GONG·Filed 2010·Application pending·0 cites
- 0624US2011175698A1Inductor with ferromagnetic metal filmDUH JENQ-GONG·Filed 2010·Application pending·0 cites
- 0717US2012181691A1Package structure, packaging substrate and chipDUH JENQ-GONG·Filed 2011·Application pending·0 cites
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