Assignee
CHENG KUN HSIEN
TW·0 granted patents·3 pending applications·0 citations·filing 2024–2025
Top patents by PatentIndex Score
3 records- 0154US2025251235A1Via waist depth detection device and method for through glass via (tgv) substrateCHENG KUN HSIEN·Filed 2024·Application pending·0 cites
- 0254US2025251352A1Via detection device and method for through glass via substrateCHENG KUN HSIEN·Filed 2024·Application pending·0 cites
- 0350US2025349622A1Defect detection device of wafer and chip packaging and detecting method of defect of wafer and chip packagingCHENG KUN HSIEN·Filed 2025·Application pending·0 cites
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