Assignee
BESI SWITZERLAND AG
CH·19 granted patents·6 pending applications·40 citations·filing 2013–2024
Top patents by PatentIndex Score
25 records- 0189US10973158B2Apparatus and method for mounting components on a substrateBESI SWITZERLAND AG·Filed 2018·Granted Apr 6, 2021·10 cites·4 claims
- 0284US8925608B2Bonding head with a heatable and coolable suction memberBESI SWITZERLAND AG·Filed 2014·Granted Jan 6, 2015·7 cites·12 claims
- 0379US9233389B2Device for dispensing adhesive on a substrateBESI SWITZERLAND AG·Filed 2014·Granted Jan 12, 2016·5 cites·2 claims
- 0475US9721819B2Method for mounting semiconductors provided with bumps on substrate locations of a substrateBESI SWITZERLAND AG·Filed 2016·Granted Aug 1, 2017·4 cites·5 claims
- 0575US9039867B2Method for detaching a semiconductor chip from a foilBESI SWITZERLAND AG·Filed 2013·Granted May 26, 2015·7 cites·5 claims
- 0673US11924974B2Apparatus for mounting components on a substrateBESI SWITZERLAND AG·Filed 2023·Granted Mar 5, 2024·0 cites·20 claims
- 0772US10288413B2Apparatus for mounting components on a substrateBESI SWITZERLAND AG·Filed 2016·Granted May 14, 2019·3 cites·9 claims
- 0866US2024363386A1Die EjectorBESI SWITZERLAND AG·Filed 2024·Application pending·0 cites
- 0964US11696429B2Apparatus and method for mounting components on a substrateBESI SWITZERLAND AG·Filed 2021·Granted Jul 4, 2023·0 cites·20 claims
- 1059US9240334B2Method for detaching a semiconductor chip from a foilBESI SWITZERLAND AG·Filed 2013·Granted Jan 19, 2016·2 cites·6 claims
- 1158US2025140631A1Component holder with a temperature-control functionBESI SWITZERLAND AG·Filed 2024·Application pending·0 cites
- 1257US9956692B2Kinematic holding system for a placement head of a placement apparatusBESI SWITZERLAND AG·Filed 2016·Granted May 1, 2018·1 cites·6 claims
- 1356US10629465B2Method for calibrating a component mounting apparatusBESI SWITZERLAND AG·Filed 2019·Granted Apr 21, 2020·1 cites·8 claims
- 1452US2026006167A1Measuring device based on a combination of optical 2d and 3d image capturing methodsBESI SWITZERLAND AG·Filed 2023·Application pending·0 cites
- 1549US12062566B2Die ejectorBESI SWITZERLAND AG·Filed 2019·Granted Aug 13, 2024·0 cites·16 claims
- 1641US9889516B2Device for dispensing and distributing flux-free solder on a substrateBESI SWITZERLAND AG·Filed 2014·Granted Feb 13, 2018·0 cites·20 claims
- 1740US9339885B2Method and apparatus for dispensing flux-free solder on a substrateBESI SWITZERLAND AG·Filed 2013·Granted May 17, 2016·0 cites·8 claims
- 1838US9666460B2Through type furnace for substrates comprising a longitudinal slitBESI SWITZERLAND AG·Filed 2014·Granted May 30, 2017·0 cites·20 claims
- 1938US2014311652A1Method And Apparatus For Mounting Electronic Or Optical Components On A SubstrateBESI SWITZERLAND AG·Filed 2014·Application pending·0 cites
- 2037US9364953B2Kinematic holding system for a placement head of a placement apparatusBESI SWITZERLAND AG·Filed 2013·Granted Jun 14, 2016·0 cites·13 claims
- 2136US2016256949A1Apparatus For Dispensing Flux-Free Solder On A SubstrateBESI SWITZERLAND AG·Filed 2016·Application pending·0 cites
- 2234US11996385B2Apparatus and method for detaching a die from an adhesive filmBESI SWITZERLAND AG·Filed 2019·Granted May 28, 2024·0 cites·8 claims
- 2333US2014175159A1Thermocompression Bonding Method And Apparatus For Mounting Semiconductor Chips On A SubstrateBESI SWITZERLAND AG·Filed 2013·Application pending·0 cites
- 2426US12230599B2Method for actuating a bonding headBESI SWITZERLAND AG·Filed 2019·Granted Feb 18, 2025·0 cites·7 claims
- 2520US12046490B2Bonding head for mounting components and die bonder with such a bonding headBESI SWITZERLAND AG·Filed 2018·Granted Jul 23, 2024·0 cites·8 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →