Assignee
APACK TECHNOLOGIES INC
US·7 granted patents·207 citations·filing 1997–2001
Top patents by PatentIndex Score
7 records- 0190US6307256B1Semiconductor package with a stacked chip on a leadframeAPACK TECHNOLOGIES INC·Filed 1998·Granted Oct 23, 2001·117 cites·11 claims
- 0285US6387795B1Wafer-level packagingAPACK TECHNOLOGIES INC·Filed 2001·Granted May 14, 2002·41 cites·6 claims
- 0357US6443059B1Solder screen printing processAPACK TECHNOLOGIES INC·Filed 2001·Granted Sep 3, 2002·8 cites·12 claims
- 0456US6376354B1Wafer-level packaging processAPACK TECHNOLOGIES INC·Filed 2001·Granted Apr 23, 2002·17 cites·5 claims
- 0538US6221689B1Method for improving the reliability of underfill process for a chipAPACK TECHNOLOGIES INC·Filed 1997·Granted Apr 24, 2001·10 cites·9 claims
- 0635US6259266B1Testing device and method for known good chipAPACK TECHNOLOGIES INC·Filed 1998·Granted Jul 10, 2001·5 cites·12 claims
- 0734US6258622B1Flip clip bonding leadframe-type packaging method for integrated circuit device and a device formed by the packaging methodAPACK TECHNOLOGIES INC·Filed 1999·Granted Jul 10, 2001·9 cites·11 claims
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