Assignee
ABDUL RAZAK RAMLAH BINTE
US·2 granted patents·14 citations·filing 2011–2012
Top patents by PatentIndex Score
2 records- 0179US8704371B2Semiconductor device having multiple bump heights and multiple bump diametersABDUL RAZAK RAMLAH BINTE·Filed 2012·Granted Apr 22, 2014·9 cites·9 claims
- 0271US8860218B2Semiconductor device having improved contact structureABDUL RAZAK RAMLAH BINTE·Filed 2011·Granted Oct 14, 2014·5 cites·10 claims
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