Method and apparatus for alignment and bonding

Abstract

A method and apparatus aligns device components based on an analysis of an image of features of the components to be aligned. The image is analyzed for deviation in component alignment, and a signal, based on the deviation, is sent to a positioning apparatus to adjust the position of the components relative to each other. The image of the components is advantageously a top view which permits measuring deviations in alignment of features on the top surfaces of components. The components are advantageously bonded together after alignment, and the alignment accuracy of the bonded components is checked.

What is claimed is: 
     
       1. A method for heat-bonding a first component to a second component, the method comprising the steps of: measuring a deviation in alignment between a first feature on a top surface of the first component and a second feature on a top surface of the second component based on an image of said first and second features, wherein said first component is held by a bonding tool configured to receive and hold said first component upon the application of a vacuum between said first component and said bonding tool, and   generating a signal as a function of said deviation to affect the alignment between said first feature and said second feature.   
     
     
       2. The method of claim 1 wherein said image is an electronic image generated based on an optical image. 
     
     
       3. The method of claim 2 wherein said optical image is reflected by a mirror. 
     
     
       4. The method of claim 1 further comprising the step of: adjusting the position of said first component relative to said second component based on said signal.   
     
     
       5. The method of claim 1 wherein the measured deviation comprises deviation measurements in a plane substantially parallel to said top surface of said first component. 
     
     
       6. The method of claim 5 wherein the measured deviation comprises a deviation measurement about an axis perpendicular to said plane. 
     
     
       7. The method of claim 1 further comprising the step of: using heat to bond together said first and second components. 
     
     
       8. The method of claim 7 further comprising the step of: based on an image of said first and second features on the bonded together first and second components, measuring a deviation in alignment between said first feature on said top surface of said first component and said second feature on said top surface of said second component.   
     
     
       9. A product comprising a first component thermally bonded to a second component, said product produced by the process of: measuring a deviation in an alignment between a first feature on a top surface of said first component and a second feature on a top surface of said second component, wherein the process of measuring is based on an image of said first and second features, wherein said first component is held by a bonding tool configured to receive and hold said first component upon the application of a vacuum between the first component and the bonding tool,   generating a signal as a function of said deviation,   adjusting the position of said first component relative to said second component based on said signal, and   bonding together said first and second components using heat.   
     
     
       10. The method of claim 9 wherein said image is an electronic image generated based on an optical image. 
     
     
       11. The method of claim 10 wherein said optical image is reflected by a mirror. 
     
     
       12. A system comprising: a heat bonding tool configured to hold and receive a first component, said first component comprising a first feature on a top surface of said first component, wherein said first feature is detectable by an imaging system when said tool holds said first component, wherein said first feature is to be aligned with a second feature on a top surface of a second component,   said imaging system for generating an image of said first feature and of said second feature.   
     
     
       13. The system of claim 12 wherein said imaging system measures a deviation in alignment between said first feature on said top surface of said first component and said second feature on said top surface of said second component based on said image. 
     
     
       14. The system of claim 13 wherein said imaging system generates a signal as a function of said deviation. 
     
     
       15. The system of claim 12 further comprising: positioning apparatus controller for positioning said first component relative to said second component based on said signal.   
     
     
       16. The system of claim 12 further comprising: heating means for bonding together said first and second components.   
     
     
       17. The system of claim 12 wherein said imaging system comprises: a sensor for generating an electronic image based on an optical image, and   a vision system for analyzing said electronic image.   
     
     
       18. The system of claim 12 wherein said imaging system further comprises a mirror wherein said mirror reflects an optical image to said sensor. 
     
     
       19. A method comprising the steps of: measuring a deviation in an alignment between a first feature on a top surface of a first component and a second feature on a top surface of a second component, wherein said first and second components are bonded together using heat, based upon an image of said first and second features, and   generating a signal as a function of said deviation to affect the alignment between said first feature and said second feature.   
     
     
       20. The method of claim 19 wherein said image is an electronic image generated based on an optical image. 
     
     
       21. The method of claim 20 wherein said optical image is reflected by a mirror. 
     
     
       22. The method of claim 19 wherein the measured deviation comprises deviation measurements in a plane substantially parallel to said top surface of said first component. 
     
     
       23. The method of claim 22 wherein the measured deviation comprises a deviation measurement about an axis perpendicular to said plane. 
     
     
       24. A method of fabricating a device, wherein said device comprises a first component and a second component to be bonded together using heat, said method comprising the steps of: measuring a deviation in alignment between a first feature on a top surface of said first component and a second feature on a top surface of said second component based upon an image of said first and second features, wherein said first component is held by a bonding tool configured to receive and hold said first component upon the application of a vacuum between the bonding tool and the first component, and   generating a signal as a function of said deviation to affect the alignment between said first feature and said second feature.   
     
     
       25. The method of claim 24 wherein said image is an electronic image generated based on an optical image. 
     
     
       26. The method of claim 25 wherein said optical image is reflected by a mirror. 
     
     
       27. The method of claim 24 further comprising the step of: adjusting the position of said first component relative to said second component based on said signal.   
     
     
       28. The method of claim 24 wherein the measured deviation comprises deviation measurements in a plane substantially parallel to said top surface of said first component. 
     
     
       29. The method of claim 28 wherein the measured deviation comprises a deviation measurement about an axis perpendicular to said plane. 
     
     
       30. The method of claim 20 further comprising the step of: based on an image of said first and second features on the bonded together first and second components, measuring a deviation in alignment between said first feature on said top surface of said first component and said second feature on said top surface of said second component.