Chemical Mechanical Polishing Conditioner

Abstract

Provided is a chemical mechanical polishing (CMP) conditioner comprising: a substrate comprising a horizontal top surface and multiple abrasive units mounted on the horizontal top surface. Each abrasive unit comprises a base of the abrasive unit, an abrasive layer, and a binding layer. The base of the abrasive unit comprises an upper surface and a lower surface. The abrasive layer is formed on the upper surface and comprises multiple abrasive tips. The binding layer is formed between the lower surface and the substrate, and an inclined plane is formed towards the lower surface. The present invention further provides a method for manufacturing the CMP conditioner. The polishing capabilities of different regions of CMP conditioner can be regulated by the abrasive units. Then the CMP conditioner of the present invention satisfies the requirements in the current industry about different polishing capabilities.

What is claimed is: 
     
         1 . A chemical mechanical polishing (CMP) conditioner comprising:
 a substrate comprising a horizontal top surface; and   multiple abrasive units respectively mounted on the horizontal top surface; each of the multiple abrasive units comprising:
 a base of the abrasive unit; 
 an abrasive layer; and 
 a binding layer; 
   the base of the abrasive unit comprising an upper surface and a lower surface;   the upper surface being opposite the lower surface;   the abrasive layer formed on the upper surface and comprising multiple abrasive tips;   the binding layer formed between the lower surface and the substrate, and   an inclined plane formed towards the lower surface.   
     
     
         2 . The CMP conditioner as claimed in  claim 1 , wherein each of the multiple abrasive units comprises a mat; the mat is mounted between the horizontal top surface of the substrate and a side of the lower surface; the binding layer is formed among the lower surface, the mat, and the horizontal top surface; the inclined plane is formed towards the lower surface. 
     
     
         3 . The CMP conditioner as claimed in  claim 1 , wherein the substrate comprises multiple concave portions; the multiple concave portions are recessed into the horizontal top surface of the substrate; each of the multiple concave portions comprises a bottom surface; each of the multiple abrasive units comprises a mat; the mat is mounted between the bottom surface of the concave portion and a side of the lower surface; the binding layer is formed among the lower surface, the mat, and the bottom surface. 
     
     
         4 . The CMP conditioner as claimed in  claim 1 , wherein the substrate comprises multiple concave portions; the multiple concave portions are formed through the substrate; the CMP conditioner comprises a base plate, and the base plate comprises a surface of the base plate; the surface of the base plate is attached on the substrate and the surface of the base plate is opposite the horizontal top surface; each of the multiple abrasive units comprises a mat; the mat is mounted among the concave portion, the surface of the base plate, and a side of the lower surface; the binding layer is formed between the lower surface and the surface of the base plate. 
     
     
         5 . The CMP conditioner as claimed in  claim 1 , wherein a height of the abrasive tip on one side is higher than a height of the abrasive tip on the other side; the difference between the heights of the abrasive tip on one side and the other side is larger than or equal to 3 μm and less than or equal to 50 μm. 
     
     
         6 . The CMP conditioner as claimed in  claim 1 , wherein the inclined plane faces toward a central axis of the substrate. 
     
     
         7 . The CMP conditioner as claimed in  claim 1 , wherein the inclined plane faces away from a central axis of the substrate. 
     
     
         8 . The CMP conditioner as claimed in  claim 1 , wherein the inclined planes of the binding layers for a part of the multiple abrasive units face toward a central axis of the substrate; the inclined planes of the binding layers for another part of the multiple abrasive units face away from the central axis of the substrate. 
     
     
         9 . The CMP conditioner as claimed in  claim 2 , wherein the inclined plane faces toward the mat of the adjacent abrasive unit tandemly. 
     
     
         10 . The CMP conditioner as claimed in  claim 1 , wherein the substrate is a stainless steel substrate, a die steel substrate, a metal alloy substrate, a ceramic substrate, a plastic substrate, or a combination thereof. 
     
     
         11 . The CMP conditioner as claimed in  claim 1 , wherein the thickness of the substrate is larger than or equal to 4 mm and less than or equal to 30 mm. 
     
     
         12 . The CMP conditioner as claimed in  claim 1 , wherein materials of the binding layer comprise ceramic materials, brazing materials, plating materials, or polymer materials. 
     
     
         13 . The CMP conditioner as claimed in  claim 1 , wherein the base of the abrasive unit is a conductive base or an insulated base; the conductive base comprises molybdenum, tungsten, or tungsten carbide; the insulated base comprises ceramic materials or single crystal materials; the ceramic materials comprise silicon carbide, and the single crystal materials comprise silicon, aluminium oxide, or sapphire. 
     
     
         14 . The CMP conditioner as claimed in  claim 1 , wherein an abrasive membrane is formed on the abrasive layer; the abrasive membrane comprises a ceramic film or a diamond film. 
     
     
         15 . The CMP conditioner as claimed in  claim 13 , wherein the shortest vertical distance between the top of the abrasive tip and the lower surface is larger than or equal to 2 mm and less than or equal to 10 mm. 
     
     
         16 . The CMP conditioner as claimed in  claim 1 , wherein a shape of the abrasive tip is blade-shaped, conical, arced, cylindrical, pyramidal, or prismatic. 
     
     
         17 . The CMP conditioner as claimed in  claim 2 , wherein a thickness of the mat is larger than or equal to 3 μm and less than or equal to 50 μm. 
     
     
         18 . The CMP conditioner as claimed in  claim 2 , wherein materials of the mat comprise stainless steel or plastic. 
     
     
         19 . A method for manufacturing a CMP conditioner comprising:
 providing multiple abrasive units;   providing a substrate comprising a horizontal top surface;   mounting multiple mats on the horizontal top surface;   abutting a side of each abrasive unit against the multiple mats respectively, and each abrasive unit contacting the horizontal top surface obliquely; and   forming a binding layer between each abrasive unit and the horizontal top surface, then obtaining the CMP conditioner.   
     
     
         20 . The method for manufacturing a CMP conditioner as claimed in  claim 19 , wherein the step of providing multiple abrasive units comprises:
 providing multiple bases of the abrasive units; each base of the abrasive units comprises an upper surface and a lower surface, and the upper surface is opposite the lower surface; and   forming an abrasive layer on the upper surface to obtain the abrasive units, and the abrasive layer comprising multiple abrasive tips.   
     
     
         21 . The method for manufacturing a CMP conditioner as claimed in  claim 20 , wherein the steps of abutting a side of each abrasive unit against the multiple mats and forming a binding layer comprise:
 abutting one side of the lower surface against the multiple mats respectively, and the other side of the lower surface contacting the horizontal top surface; then each abrasive unit contacting the horizontal top surface obliquely; and   forming the binding layer between the lower surface and the horizontal top surface to obtain the CMP conditioner.   
     
     
         22 . The method for manufacturing a CMP conditioner as claimed in  claim 20 , wherein the step of abutting a side of each abrasive unit against the multiple mats comprises:
 providing a flat jig comprising a jig surface;   mounting multiple mats on the jig surface;   abutting one side of the abrasive layer against the multiple mats respectively, and the other side of the abrasive layer contacting the jig surface;   mounting the substrate on the lower surface of each abrasive unit horizontally, then each abrasive unit contacting the horizontal top surface obliquely; and   wherein the step of forming a binding layer comprises:   forming the binding layer between the lower surface and the horizontal top surface, then removing the flat jig and the multiple mats; obtaining the CMP conditioner finally.