Light emitting module

Abstract

A light emitting module including a light emitting device package structure and a heat dissipation structure is provided. The light emitting device package structure includes light emitting devices, a patterned reflective element and a patterned conductive layer. The patterned reflective element is disposed around side surfaces of the light emitting devices and exposes a first bottom surface of a first pad and a second bottom surface of a second pad. The patterned conductive layer is disposed on the first bottom surface of the first pad and the second bottom surface of the second pad. The light emitting devices are electrically connected to each other in a series connection, a parallel connection or a series-parallel connection through the patterned conductive layer. The heat dissipation structure is disposed below the light emitting device package structure and includes a heat dissipation unit and a patterned circuit layer disposed on the heat dissipation unit.

What is claimed is: 
     
         1 . A light emitting module, comprising:
 a light emitting device package structure, comprising:
 a plurality of light emitting devices, each of the light emitting devices having an upper surface and a lower surface opposite to each other, a side surface connecting the upper surface and the lower surface and a first pad and a second pad located on the lower surface and separated from each other; 
 a patterned reflective element, disposed around the side surfaces of the light emitting devices, and exposing a first bottom surface of the first pad and a second bottom surface of the second pad of each of the light emitting devices; 
 a patterned conductive layer, disposed on the first bottom surface of the first pad and the second bottom surface of the second pad of each of the light emitting devices, wherein the light emitting devices are electrically connected to each other in a series connection, a parallel connection or a series-parallel connection through the patterned conductive layer; and 
   a heat dissipation structure, disposed below the light emitting device package structure, and comprising a heat dissipation unit and a patterned circuit layer disposed on the heat dissipation unit, wherein the light emitting device package structure is electrically connected to the patterned circuit layer through the patterned conductive layer.   
     
     
         2 . The light emitting module as claimed in  claim 1 , wherein the light emitting devices are arranged in an array. 
     
     
         3 . The light emitting module as claimed in  claim 1 , wherein the heat dissipation unit comprises a ceramic substrate or a heat sink. 
     
     
         4 . The light emitting module as claimed in  claim 1 , further comprising:
 a molding compound, disposed on the upper surfaces of the light emitting devices, wherein the molding compound comprises a transparent molding compound or a molding compound doped with phosphor.   
     
     
         5 . The light emitting module as claimed in  claim 4 , wherein a first circumferential surface of the patterned reflective element is aligned with a second circumferential surface of the molding compound. 
     
     
         6 . The light emitting module as claimed in  claim 1 , wherein each of the light emitting devices is a flip-chip light emitting device. 
     
     
         7 . The light emitting module as claimed in  claim 1 , wherein a top surface of the patterned reflective element is aligned with the upper surface of each of the light emitting devices. 
     
     
         8 . The light emitting module as claimed in  claim 1 , wherein the first bottom surface of the first pad and the second bottom surface of the second pad of each of the light emitting devices are aligned with a bottom surface of the patterned reflective element. 
     
     
         9 . The light emitting module as claimed in  claim 1 , wherein reflectivity of the patterned reflective element is at least greater than 90%. 
     
     
         10 . The light emitting module as claimed in  claim 1 , further comprising:
 an adhesive layer, disposed between the patterned conductive layer of the light emitting device package structure and the patterned circuit layer of the heat dissipation structure.