Method of manufacturing semiconductor device and method of cleaning semiconductor substrate

Abstract

A method of manufacturing a semiconductor device includes: holding a semiconductor substrate with a surface inclined with respect to the vertical direction and the horizontal direction; and immersing the semiconductor substrate in a cleaning solution including an acid.

1 . A method of manufacturing a semiconductor device comprising:
 holding a semiconductor substrate with a surface inclined with respect to the vertical direction and the horizontal direction; and   immersing the semiconductor substrate in a cleaning solution including an acid.   
     
     
         2 . The method of manufacturing a semiconductor device according to  claim 1 , further comprising,
 forming a compound semiconductor layer on the semiconductor substrate before holding the semiconductor substrate.   
     
     
         3 . The method of manufacturing a semiconductor device according to  claim 2 , further comprising,
 forming a recess in the compound semiconductor layer before holding the semiconductor substrate.   
     
     
         4 . The method of manufacturing a semiconductor device according to  claim 3 , further comprising,
 forming a gate-insulating film on the inner surface of the recess before holding the semiconductor substrate.   
     
     
         5 . The method of manufacturing a semiconductor device according to  claim 1 , wherein the inclination angle with respect to the vertical direction is 10° to 80° and the inclination angle with respect to the horizontal direction is 10° to 80°. 
     
     
         6 . The method of manufacturing a semiconductor device according to  claim 1 , further comprising,
 placing the semiconductor substrate in a cleaning apparatus which includes a supporting member for supporting the semiconductor substrate and a locking member for locking the semiconductor substrate inclined with respect to the vertical direction and the horizontal direction.   
     
     
         7 . The method of manufacturing a semiconductor device according to  claim 6 , further comprising,
 rotating a case which houses the supporting member and the locking member.   
     
     
         8 . The method of manufacturing a semiconductor device according to  claim 6 , further comprising,
 rotating a rotary driving member in contact with the semiconductor substrate.   
     
     
         9 . The method of manufacturing a semiconductor device according to  claim 6 , further comprising,
 performing a ultraviolet treatment on the cleaning apparatus before the semiconductor substrate is placed in the cleaning apparatus.   
     
     
         10 . The method of manufacturing a semiconductor device according to  claim 6 , further comprising,
 performing a ultraviolet treatment on a carrier unit for carrying the semiconductor substrate to the cleaning apparatus before the semiconductor substrate is placed in the cleaning apparatus.   
     
     
         11 . The method of manufacturing a semiconductor device according to  claim 1 , further comprising,
 performing spin drying on the semiconductor substrate after an immersion of the semiconductor substrate.   
     
     
         12 . The method of manufacturing a semiconductor device according to  claim 11 , further comprising,
 performing drying treatment on a unit used for the spin drying before spin drying of the semiconductor substrate.   
     
     
         13 . A method of cleaning a semiconductor substrate comprising:
 holding a semiconductor substrate with a surface inclined with respect to the vertical direction and the horizontal direction; and   immersing the semiconductor substrate in a cleaning solution containing an acid.   
     
     
         14 . The method of cleaning a semiconductor substrate according to  claim 13 , wherein the inclination angle with respect to the vertical direction is 10° to 80° and the inclination angle with respect to the horizontal direction is 10° to 80°. 
     
     
         15 . The method of cleaning a semiconductor substrate according to  claim 13 , further comprising,
 placing the semiconductor substrate in a cleaning apparatus which includes a supporting member for supporting the semiconductor substrate and a locking member for locking the semiconductor substrate inclined with respect to the vertical direction and the horizontal direction.   
     
     
         16 . The method of cleaning a semiconductor substrate according to  claim 15 , further comprising,
 rotating the cleaning apparatus.   
     
     
         17 . The method of cleaning a semiconductor substrate according to  claim 15 , further comprising,
 rotating a rotary driving member in contact with the semiconductor substrate.   
     
     
         18 . A cleaning apparatus comprising:
 a supporting member to support a semiconductor substrate; and   a locking member to lock the semiconductor substrate such that the semiconductor substrate is inclined with respect to the vertical direction and the horizontal direction.   
     
     
         19 . The cleaning apparatus according to  claim 18 , further comprising,
 a rotary driving member to rotate the semiconductor substrate by rotating a case that houses the supporting member and the locking member.   
     
     
         20 . The cleaning apparatus according to  claim 18 , further comprising,
 a rotary driving member, being in contact with the semiconductor substrate, to rotate the semiconductor substrate in the cleaning apparatus.