Method for manufacturing wiring board

Abstract

There is prepared an insulation layer generation member having a support film and a semi-cured insulation layer provided on a surface of the support film. Subsequently, the insulation layer generation member is affixed to a pad such that the pad contacts the semi-cured insulation layer. The semi-cured insulation layer is cured, to thus generate an insulation layer. Subsequently, the insulation layer is exposed to laser by way of the support film, thereby opening an opening in the insulation layer.

1 . A method for manufacturing a wiring board, comprising:
 an insulation layer generation member preparation step of preparing an insulation layer generation member having a support film made of a resin and a semi-cured insulation layer provided on a surface of the support film;   an insulation layer generation member affixing step of affixing the insulation layer generation member to a pad such that the pad contacts the semi-cured insulation layer;   an insulation layer curing step of curing the semi-cured insulation layer by heating the semi-cured insulation layer together with the support film after the insulation layer generation member affixing step; and   an opening generation step of exposing the cured insulation layer to a laser by way of the support film, wherein the laser is irradiated onto a top surface of the support film thereby opening an opening in the support film and an opening in the cured insulation layer, the opening is formed in the support film and the insulation layer at the same time, and the opening exposes the pad.   
     
     
         2 . The method for manufacturing a wiring board according to  claim 1 , further comprising:
 a support film removal step of removing the support film from the cured insulation layer after the opening generation step; and   a via generation step of generating a via in the opening after the support film removal step.   
     
     
         3 . The method for manufacturing a wiring board according to  claim 2 , wherein removal of the support film is performed immediately before the via generation step. 
     
     
         4 . The method for manufacturing a wiring board according to  claim 1 , wherein the semi-cured insulation layer is a semi-cured resin layer containing silica particles. 
     
     
         5 . The method for manufacturing a wiring board according to  claim 1 , wherein the semi-cured insulation layer has a core material and a semi-cured resin layer covering the core material. 
     
     
         6 . The method for manufacturing a wiring board according to  claim 5 , wherein the semi-cured resin layer contains silica particles. 
     
     
         7 . The method for manufacturing a wiring board according to  claim 5 , wherein the core material is glass fiber. 
     
     
         8 . (canceled) 
     
     
         9 . (canceled) 
     
     
         10 . The method for manufacturing a wiring board according to  claim 1 , wherein the insulation layer is cured by heating and applying the pressure together with the support film. 
     
     
         11 . The method for manufacturing a wiring board according to  claim 1 , wherein the support film is made of polyester such as PET (polyethylene terephthalate), polyethylene, polyolefin such as polyvinyl chloride, or polycarbonate. 
     
     
         12 . The method for manufacturing a wiring board according to  claim 1 , wherein the thickness of the support film is 30 μm to 40 μm. 
     
     
         13 . The method for manufacturing a wiring board according to  claim 1 , wherein the semi-cured insulation layer is made of an epoxy resin having a thermosetting characteristic or a thermosetting polyolefin-based resin.