Module ic package structure and method for making the same

Abstract

A module IC package structure includes a substrate unit, an electronic unit, a conductive unit, a package unit and a shielding unit. The substrate unit includes a circuit substrate having at least one grounding pad. The electronic unit includes a plurality of electronic elements electrically connected to the circuit substrate. The conductive unit includes at least one elastic conductive element disposed on the circuit substrate, and the elastic conductive element has a first end portion electrically connected to the grounding pad. The package unit includes a package resin body disposed on the circuit substrate to cover the electronic elements and one part of the elastic conductive element, and the elastic conductive element has a second end portion is exposed from the package resin body. The shielding unit includes a metal shielding layer formed on the outer surface of the package resin body to electrically contact the second end portion.

1 . A module IC package structure, comprising:
 a substrate unit including at least one circuit substrate having at least one grounding pad;   an electronic unit including a plurality of electronic elements disposed on and electrically connected to the circuit substrate;   a conductive unit including at least one elastic conductive element disposed on the circuit substrate, wherein the elastic conductive element has a first end portion electrically connected to the grounding pad;   a package unit including a package resin body disposed on the circuit substrate to cover the electronic elements and one part of the elastic conductive element, wherein the elastic conductive element has a second end portion is exposed; and   a shielding unit including a metal shielding layer formed on the outer surface of the package resin body to electrically contact the second end portion of the elastic conductive element.   
     
     
         2 . The module IC package structure of  claim 1 , wherein the grounding pad is disposed on the top surface of the circuit substrate, and the bottom surface of the first end portion electrically contacts the grounding pad. 
     
     
         3 . The module IC package structure of  claim 1 , wherein the package resin body has an opening formed on the top surface thereof for exposing the second end portion of the elastic conductive element, and the opening of the package resin body is covered by the metal shielding layer. 
     
     
         4 . The module IC package structure of  claim 1 , wherein the second end portion of the elastic conductive element has a top surface flush with the top surface of the package resin body, and the metal shielding layer covers and electrically contacts the top surface of the second end portion. 
     
     
         5 . The module IC package structure of  claim 1 , wherein the second end portion of the elastic conductive element has a grinding surface flush with the top surface of the package resin body, and the metal shielding layer covers and electrically contacts the grinding surface of the second end portion. 
     
     
         6 . The module IC package structure of  claim 1 , wherein the metal shielding layer is a conductive spray layer, a conductive sputtering layer, a conductive printing layer or a conductive electroplating layer. 
     
     
         7 . The module IC package structure of  claim 1 , wherein each elastic conductive element is a conductive metal or an electronic component with conductive function. 
     
     
         8 . A method for making a module IC package structure, comprising the steps of:
 providing at least one circuit substrate having at least one grounding pad;   placing a plurality of electronic elements on the circuit substrate to electrically connect to the circuit substrate;   placing at least one elastic conductive element on the circuit substrate, wherein the elastic conductive element has a first end portion electrically connected to the grounding pad and a second end portion;   forming a package resin body on the circuit substrate to cover the electronic elements and the elastic conductive element;   removing one part of the package resin body to form an exposed top surface on the second end portion of the elastic conductive element or removing one part of the elastic conductive element to form an exposed grinding surface on the second end portion of the elastic conductive element; and   forming a metal shielding layer on the outer surface of the package resin body and the exposed top or grinding surface of the second end portion of the elastic conductive element to electrically contact the second end portion of the elastic conductive element.   
     
     
         9 . The method of  claim 8 , wherein the grounding pad is disposed on the top surface of the circuit substrate, and the bottom surface of the first end portion electrically contacts the grounding pad. 
     
     
         10 . The method of  claim 8 , wherein the package resin body has an opening formed on the top surface thereof for exposing the second end portion of the elastic conductive element, and the opening of the package resin body is covered by the metal shielding layer. 
     
     
         11 . The method of  claim 8 , wherein the exposed top or grinding surface of the second end portion of the elastic conductive element is flush with the top surface of the package resin body, and the metal shielding layer electrically contacts the exposed top or grinding surface of the second end portion of the elastic conductive element. 
     
     
         12 . The method of  claim 8 , wherein the metal shielding layer is formed by spraying, sputtering, printing or electroplating. 
     
     
         13 . A method for making a module IC package structure with electrical shield function, comprising the steps of:
 providing at least one circuit substrate having at least one grounding pad;   placing a plurality of electronic elements on the circuit substrate to electrically connect to the circuit substrate;   placing at least one elastic conductive element on the circuit substrate, wherein the elastic conductive element has a first end portion electrically connected to the grounding pad and a second end portion;   forming a package resin body on the circuit substrate to cover the electronic elements and one part of the elastic conductive element, wherein the top surface of the second end portion of the elastic conductive element is exposed from the package resin; and   forming a metal shielding layer on the outer surface of the package resin body and the top surface of the second end portion of the elastic conductive element to electrically contact the second end portion of the elastic conductive element.   
     
     
         14 . The method of  claim 13 , wherein the grounding pad is disposed on the top surface of the circuit substrate, and the bottom surface of the first end portion electrically contacts the grounding pad. 
     
     
         15 . The method of  claim 13 , wherein the package resin body has an opening formed on the top surface thereof for exposing the second end portion of the elastic conductive element, and the opening of the package resin body is covered by the metal shielding layer. 
     
     
         16 . The method of  claim 13 , wherein the top surface of the second end portion of the elastic conductive element is flush with the top surface of the package resin body, and the metal shielding layer electrically contacts the top surface of the second end portion of the elastic conductive element. 
     
     
         17 . The method of  claim 13 , wherein the metal shielding layer is formed by spraying, sputtering, printing or electroplating.