Quickly replaceable processing-laser modules and subassemblies

Abstract

Pre-aligned, kinematically mounted modules including processing lasers, beam trains, and individually calibrated control beams are quickly and easily replaced on subassembly bases with minimal in situ alignment, and can maintain working-spot position to micron tolerances over ambient temperature variations of ±10° C. Subassembly bases, with features for kinematically mating to a plurality of pre-aligned laser modules and to a platform base incorporated in the laser processing tool, enable multi-module subassemblies to be quickly replaced with spare subassemblies of the same type, or swapped for subassemblies of a different type. The mating features and reversible locks are designed to mitigate thermal effects that are often a dominant cause of alignment drift in processing lasers.

1 .- 15 . (canceled) 
     
     
         16 . A method of providing quickly replaceable processing-laser modules, comprising:
 attaching a module mounting base to an alignment fixture base by
 kinematically mating a locating feature on the module mounting base with a receiving feature on the alignment fixture base, and 
 temporarily locking the module baseplate in place on the alignment fixture; 
   mounting a working laser on the module mounting base;   aligning a working beam emitted by the working laser using alignment tools positioned by tool-positioning features on the alignment fixture base;   locking the working beam alignment;   mounting a working component designed to steer or shape the working beam on the module mounting base;   aligning the working component using alignment tools positioned by tool-positioning features on the alignment fixture base;   locking the working component alignment;   unlocking the module mounting base from the alignment fixture base; and   detaching the module mounting base from the alignment fixture base.   
     
     
         17 . The method of  claim 16 , further comprising, after said locking the working component alignment, attaching a housing or cover to the module mounting base. 
     
     
         18 . The method of  claim 16 , further comprising, after said detaching the module base, storing the module comprising the module mounting base and any lasers and components attached to the module base in a clean, stable environment. 
     
     
         19 . The method of  claim 16 , further comprising, before said unlocking the module base, mounting a control light source on the module mounting base, aligning a control beam emitted by the control light source using alignment tools positioned by tool-positioning features on the alignment fixture base, and locking the control beam alignment. 
     
     
         20 . The method of  claim 19 , further comprising, after said locking the control beam alignment;
 mounting a control component designed to steer or shape the control beam on the module mounting base;   aligning the control component using alignment tools positioned by tool-positioning features on the alignment fixture base; and   locking the control component alignment.   
     
     
         21 . The method of  claim 20 , further comprising, after said locking the control component alignment, calibrating the control beam and its control electronics to the characteristics of the working beam. 
     
     
         22 . A method of quickly changing subassemblies comprising a plurality of pre-aligned laser modules attached to a subassembly base, where a first subassembly base attached to a first plurality of pre-aligned laser modules is kinematically mated and temporarily locked to a platform base on a laser processing tool, comprising:
 disengaging a subassembly-lock on the first subassembly base from a subassembly-lock receiver on the platform base;   removing the first subassembly plate with its attached pre-aligned laser modules from the platform base;   placing a second subassembly plate with a second plurality of attached pre-aligned laser modules on the platform base so that a subassembly-locating feature on the second subassembly base kinematically mates to a subassembly-receiving feature on the platform base; and   engaging a subassembly-lock on the first subassembly base to the subassembly-lock receiver on the platform base.