Heat Dissipation Apparatus for Data Center

Abstract

The present invention discloses a heat dissipation apparatus that comprises at least a boiling houses, a condenser and an air channel. Each boiling house is provided to receive heat from at least a server, and is connected with a loop pipe filled with a first fluid. Each condenser is connected with the loop pipe so as to remove the heat from each boiling house. The cooling conduit is provided to receive a second fluid for conveying the second fluid to each condenser. The air channel is provided to receive a third fluid for transferring the heat from the condenser into a predetermined space.

1 . A heat dissipation apparatus, for cooling at least one server in a data center, comprising:
 at least one boiling house, receiving heat from said at least one server and being connected with a loop pipe filled with a first fluid;   a condenser, connected with said loop pipe so as to remove the heat from said at least one boiling house; and   an air channel, receiving a second fluid for transferring the heat from said condenser into a predetermined space;   wherein said first fluid flows in one direction along said loop pipe so as to transfer the heat from said at least one boiling house into said condenser via said loop pipe, and said first fluid is different than said second fluid.   
     
     
         2 . The heat dissipation apparatus according to  claim 1 , further comprising a cooling conduit that receives a third fluid for conveying said third fluid to said condenser. 
     
     
         3 . The heat dissipation apparatus according to  claim 2 , further comprising a middle conduit that connects said cooling conduit. 
     
     
         4 . The heat dissipation apparatus according to  claim 1 , wherein said first fluid is selected from the group consisting of water, ammonia, solvent, refrigerant and coolant, or combination thereof. 
     
     
         5 . The heat dissipation apparatus according to  claim 1 , wherein said second fluid is ambient air. 
     
     
         6 . The heat dissipation apparatus according to  claim 2 , wherein said third fluid is cool air. 
     
     
         7 . The heat dissipation apparatus according to  claim 2 , wherein said second fluid and said third fluid are the same fluid. 
     
     
         8 . The heat dissipation apparatus according to  claim 1 , wherein said predetermined space is outside said data center. 
     
     
         9 . The heat dissipation apparatus according to  claim 1 , wherein said predetermined space is inside said data center. 
     
     
         10 . The heat dissipation apparatus according to  claim 1 , further comprising a fan, said fan being arranged opposite to said condenser and being connected to said middle conduit so as to remove the heat from said condenser. 
     
     
         11 . The heat dissipation apparatus according to  claim 3 , wherein said middle conduit maintains a uniform average temperature. 
     
     
         12 . The heat dissipation apparatus according to  claim 1 , wherein said first fluid is a vapor-type heat before it flows to said condenser from said at least one boiling house along said loop pipe, and is a liquid-type fluid when it flows after said condenser. 
     
     
         13 . The heat dissipation apparatus according to  claim 1 , wherein said condenser further comprises a plurality of fins arranged in an interleaving fashion. 
     
     
         14 . A heat dissipation apparatus, for cooling at least one server in a data center, comprising:
 at least one boiling house, receiving heat from said at least one server and being connected with a loop pipe filled with a first fluid;   a cold plate, connected with said loop pipe and filled with said first fluid so as to remove the heat from said at least one boiling house;   a cold box, arranged opposite to said cold plate so as to transfer the heat from said cold plate to said cold box; and   a water pipe, filled with a second fluid to connect with said cold box so as to remove the heat from said cold box;   wherein said first fluid flows in one direction along said loop pipe.   
     
     
         15 . The heat dissipation apparatus according to  claim 14 , wherein said cold plate is selected from the group consisting of aluminum and copper. 
     
     
         16 . The heat dissipation apparatus according to  claim 14 , wherein said first fluid is selected from the group consisting of water, ammonia, solvent, refrigerant and coolant, or combination thereof. 
     
     
         17 . The heat dissipation apparatus according to  claim 14 , wherein said cold plate has on its one side a thermal interface material for connecting said cold box. 
     
     
         18 . The heat dissipation apparatus according to  claim 14 , wherein said first fluid is a vapor-type heat when it flows to said cold plate from said at least one boiling house along said loop pipe, and is a liquid-type fluid when it flows after said cold plate along said loop pipe. 
     
     
         19 . The heat dissipation apparatus according to  claim 14 , further comprising a chiller to connect with said water pipe so as to cool said second fluid for recycling. 
     
     
         20 . The heat dissipation apparatus according to  claim 19 , further comprising a pump to connect with said water pipe so as to facilitate recycling of said second fluid.