Semiconductor device using semiconductor chip

Abstract

A semiconductor device includes an insulating substrate 2 having an obverse surface formed with a die pad 3 , a rectangular semiconductor chip 7 such as an LED chip bonded to the die pad with a die bonding material 10 , and a molded portion 9 made of a synthetic resin for packaging the semiconductor chip. The die pad 3 may be rectangular with dimensions close to those of the semiconductor chip or circular with a diameter close to the diagonal dimension of the semiconductor chip, whereby the positioning and orienting of the semiconductor chip can be accurately performed in bonding the semiconductor chip.

1 - 11 . (canceled)  
     
     
         12 . A semiconductor device comprising: an insulating substrate having an obverse surface formed with a die pad made of a metal film and a pair of electrode terminals made of a metal film; a semiconductor chip which is square or generally square as viewed in plan and bonded to an obverse surface of the die pad with a die bonding material; and a molded portion made of a synthetic resin for packaging the semiconductor chip; 
 wherein the die pad is circular as viewed in plan and has a diameter which approximates a diagonal dimension of the semiconductor chip,    wherein a narrow patterned conductor made of a metal film is provided between the die pad and one of the electrode terminals to integrally connect the die pad and the electrode terminal to each other, the narrow patterned conductor being positioned on a longitudinal centerline of the insulating substrate;    wherein the semiconductor chip has a diagonal line located on the longitudinal centerline of the insulating substrate.    
     
     
         13 . The semiconductor device according to  claim 12 , wherein the diameter of the die pad is 0.6 to 1.5 times the diagonal dimension of the semiconductor chip.  
     
     
         14 . The semiconductor device according to  claim 12 , wherein the semiconductor chip comprises an LED chip, and wherein the molded portion is light-permeable.