Method for reducing mask precipitation defects

Abstract

In a container for transporting a reticle during a semiconductor manufacturing process, the reticle including a base made of isolating material and a metallic layer deposited onto a surface of the base, disclosed is a method for isolating and removing environmental contaminants which includes filling the container with inert gas, thereby purging the environmental contaminants, as well as inlet and outlet features to allow for the purging of clean inert gas and impurities.

1 . In a container for transporting a reticle during a semiconductor manufacturing process, the reticle comprising a base made of isolating material and a metallic layer deposited onto a surface of the base, a method for removing environmental contaminants which comprises filling the container with inert gas, thereby purging said environmental contaminants.  
   
   
       2 . The method as recited in  claim 1 , wherein mask repeating defects are reduced by purging said environmental contaminants.  
   
   
       3 . The method as recited in  claim 1 , wherein the lifetime of a 193 nm mask is increased by purging said environmental contaminants.  
   
   
       4 . The method as recited in  claim 1 , wherein photo-productivity is increased by purging said environmental contaminants.  
   
   
       5 . The method as recited in  claim 1 , wherein the frequency of mask cleaning is reduced by purging said environmental contaminants.  
   
   
       6 . The method as recited in  claim 1 , wherein the photo re-work rate is decreased by purging said environmental contaminants.  
   
   
       7 . The method as recited in  claim 1 , wherein the container is a reticle pod.  
   
   
       8 . The method as recited in  claim 1 , wherein the container is a reticle stocker.  
   
   
       9 . The method as recited in  claim 1 , wherein the container is a reticle library.  
   
   
       10 . In a container for transporting a reticle during a semiconductor manufacturing process, the reticle comprising a base made of isolating material and a metallic layer deposited onto a surface of the base, a method for removing reactants in the container which comprises filling the container with inert gas, thereby purging said reactants.  
   
   
       11 . The method as recited in  claim 10 , wherein mask repeating defects are reduced by purging said reactants.  
   
   
       12 . The method as recited in  claim 10 , wherein the lifetime of a 193 nm mask is increased by purging said reactants.  
   
   
       13 . The method as recited in  claim 10 , wherein photo-productivity is increased by purging said reactants.  
   
   
       14 . The method as recited in  claim 10 , wherein the frequency of mask cleaning is reduced by purging said reactants.  
   
   
       15 . The method as recited in  claim 10 , wherein the photo re-work rate is decreased by purging said reactants.  
   
   
       16 . The method as recited in  claim 10 , wherein the container is a reticle pod.  
   
   
       17 . The method as recited in  claim 10 , wherein the container is a reticle stocker.  
   
   
       18 . The method as recited in  claim 10 , wherein the container is a reticle library.