Die pickup apparatus

Abstract

The object of the present invention is to make it possible to pick up dies securely using a die push-up member without damaging the dies. A die push-up member 22 used for die-peeling which pushes the dies upward is disposed inside the suction holding stage 10 further toward the die feeding direction side than the die push-up member 21 used for die-pickup so that this die push-up member 22 can be move upward and downward. With the die push-up member 22 lowered, the die end portion (with respect to the die feeding direction) of the die 1 A that is picked up is moved to above the die push-up member 22 . Then, the die push-up member 22 is raised so that the die end portion (with respect to the die feeding direction) of the die 1 A is peeled from the wafer sheet 2 . Then, when the die push-up member 22 remaining in a raised state, the die 1 A is fed to the pickup center 5 , and is picked up by the collet 4 and die push-up member 21.

1 . A die pickup apparatus comprising: 
 a suction holding stage that suction-holds a wafer sheet on which dies are pasted,    a die push-up member used for die-pickup which is disposed in said suction holding stage and pushes up a die, and    a collet which suction-holds a die that is pushed up by the die push-up member used for die-pickup and which conveys said die;    wherein said die-pickup apparatus further comprises a die push-up member used for die-peeling, said die push-up member used for die-peeling being movable upward and downward and provided inside said suction holding stage so as to be on a die feeding side with respect to said die push-up member used for die-pickup; and    wherein said die-pickup apparatus, 
 with said die push-up member used for die-peeling lowered, moves an end portion of a die which is to be picked up located on the die feeding direction side to above said die push-up member used for die-peeling,  
 raises said die push-up member used for die-peeling so that the end portion of the die located on the die feeding direction side is peeled from said wafer sheet,  
 subsequently feeds the die with said die push-up member used for die-peeling raised, so that the die is partially or entirely peeled, and  
 allows said collet to pick up the die.  
   
   
   
       2 . A die pickup apparatus comprising: 
 a suction holding stage that suction-holds a wafer sheet on which dies are pasted,    a die push-up member used for die-pickup which is disposed in said suction holding stage and pushes up a die, and    a collet which suction-holds a die that is pushed up by the die push-up member used for die-pickup and which conveys said die;    wherein said die-pickup apparatus further comprises a die push-up member used for die-peeling, said die push-up member used for die-peeling being movable upward and downward and provided inside said suction holding stage so as to be on a die feeding side with respect to said die push-up member used for die-pickup; and    wherein said die-pickup apparatus, 
 with said die push-up member used for die-peeling lowered, moves an end portion of a die which is to be picked up located on the die feeding direction side to above said die push-up member used for die-peeling,  
 raises said die push-up member used for die-peeling so that the end portion of the die located on the die feeding direction side is peeled from said wafer sheet,  
 subsequently feeds the die after said die push-up member used for die-peeling is lowered, so that the die is partially or entirely peeled, and  
 allows said collet to pick up the die.  
   
   
   
       3 . A die pickup apparatus comprising: 
 a suction holding stage that suction-holds a wafer sheet on which dies are pasted,    a die push-up member which is disposed at a pickup center in said suction holding stage and pushes up a die, and    a collet which suction-holds a die that is pushed up by the die push-up member and which conveys said die; wherein    said suction holding stage is provided with a suction hole in an upper surface thereof so that the suction hole is located at said pickup center of said suction holding stage; and    wherein said die pickup apparatus, 
 with said die push-up member lowered, moves an end portion of a die which is to be picked up located on the die feeding direction side to above said die push-up member,  
 raises said die push-up member so that the end portion of the die located on the die feeding direction side is peeled from said wafer sheet,  
 subsequently causes the die to move while riding over said die push-up member with said die push-up member remaining in a raised position,  
 feeds back said die to the pickup center, and  
 allows said collet to pick up the die.  
   
   
   
       4 . A die pickup apparatus comprising: 
 a suction holding stage that suction-holds a wafer sheet on which dies are pasted,    a die push-up member which is disposed at a pickup center in said suction holding stage and pushes up a die, and    a collet which suction-holds a die that is pushed up by the die push-up member and which conveys said die; wherein    said suction holding stage is provided with a suction hole in an upper surface thereof so that the suction hole is located at said pickup center of said suction holding stage; and    wherein said die pickup apparatus, 
 with said die push-up member used for die pickup lowered, moves an end portion of a die which is to be picked up located on the die feeding direction side to above said die push-up member,  
 raises said die push-up member so that the end portion of the die located on the die feeding direction side is peeled from said wafer sheet,  
 subsequently lowers said die push-up member and moves the die end portion located on the die feeding direction side to above said suction hole,  
 feeds back said die to the pickup center, and  
 allows said collet to pick up the die.  
   
   
   
       5 . A die pickup apparatus comprising: 
 a suction holding stage that suction-holds a wafer sheet on which dies are pasted,    a die push-up member which is disposed at a pickup center in said suction holding stage and pushes up a die, and    a collet which suction-holds a die that is pushed up by the die push-up member and which conveys said die; wherein    said suction holding stage is provided with a suction hole in an upper surface thereof so that the suction hole is located at said pickup center of said suction holding stage; and    wherein said die pickup apparatus, 
 moves an end portion of a die which is to be picked up located on the die feeding direction side to above said suction hole,  
 applies vacuum suction to said suction holding stage so that the end portion of the die located on said die feeding direction side is peeled from said wafer sheet,  
 subsequently feeds back the die to the pickup center, and  
 allows said collet to pick up the die.  
   
   
   
       6 . The die pickup apparatus according to  claim 1  or  2 , wherein said die push-up member used for die-pickup is provided in a plurality of numbers.  
   
   
       7 . The die pickup apparatus according to any of claims  3  through  5 , wherein said die push-up member is provided in a plurality of numbers.  
   
   
       8 . The die pickup apparatus according to  claim 1  or  2 , wherein said die push-up member used for die-pickup is provided three or more, and a die push-up member in a center is formed higher than push-up members on both sides.  
   
   
       9 . The die pickup apparatus according to any of claims  3  through  5 , wherein said die push-up member is provided three or more, and a die push-up member in a center is formed higher than push-up members on both sides.