Silicone epoxy formulations

Abstract

An encapsulant composition is provided. The composition includes an epoxy composition including at least two siloxane repeat units and a curing agent. The encapsulant composition is particularly suited for encapsulating light emitting diode components.

1 . An encapsulant composition comprising: 
 a. an epoxy including at least two siloxane repeat units, and    b. a curing agent.    
   
   
       2 . The composition of  claim 1  wherein said epoxy comprises 1,3-bis(1,2-epoxy-4-cyclohexylethyl)-1,1,3,3-tetramethyldisiloxane.  
   
   
       3 . The composition of  claim 1  wherein said composition is comprised of between about 2 and about 15 repeat (H 3 C) 2  SiO units.  
   
   
       4 . The composition of  claim 3  wherein said units are substituted.  
   
   
       5 . The composition of  claim 4  wherein said siloxane repeat units are substituted with functional groups selected from the group consisting of cycloaliphatic groups, cycloaliphatic epoxy groups, glycidoxy groups, and mixture thereof.  
   
   
       6 . The composition of  claim 1  wherein said curing agent is selected from the group consisting of resins obtained by the condensation or co-condensation of phenols and naphthols with aldehydes, aralkyl phenolic resins, amines, amides, phenols, thiols, carboxylic acids, carboxylic anhydrides, and mixtures thereof.  
   
   
       7 . The composition of  claim 1  further comprising a filler having a particle size less than about 400 nm and selected from the group consisting of non-conductive carbon; powders of fused silica, crystalline silica, alumina, zircon, calcium silicate, calcium carbonate, silicon carbide, boron nitride, beryllia, zirconia; single-crystal fibers of potassium titanate, silicon carbide, silicon nitride, alumina; glass fibers; inorganic fillers having a flame retardant effect, and mixtures thereof.  
   
   
       8 . The composition of  claim 1  further including a coupling agent.  
   
   
       9 . The composition of  claim 8  wherein said coupling agent is selected from the group consisting of vinyltrichlorosilane, vinyltriethoxysilane, vinyltris(β-methoxyethyoxy) silane, γ-methacryloxypropyltiimethoxysilane, β-(3,4-epoxydicyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, vinlytriacetoxysilane, γ-mercaptopropyltirmethoxysilane, γ-aminopropyltriethoxysilane, y-[bis-(β-hydroxyethyl)] amino-propyltriethoxysilane, N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, γ-(β-aminoethyl)aminopropyldimethoxymethylsilane, N-(trimethoxysiliylpropyl) ethylenediamine, N-(dimethoxysilylisopropyl)ethylenediamine, methyltrimethoxysilane, methyltriethoxysilane, n-β-(N-vinylbenzylaminoethyl)-γ-aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, hexamethyldisilane, γ-anilinopropyltriethoxysilaen, vinyltrimethoxysilane and γ-mercaptopropylmethyldimethoxysilane, isopropyltriisosteroyl titanate, isopropyltris(diocyl pyrophosphate) titanate, isopropyltri(N-aminoethyl-aminoethyl)titanate, tetraoctylbis(ditridecyl phosphite) titanate, tetra(2,2-diallyloxymethyl-1-butyl)bis(ditridecyl)phophite titanate, bis(dioctyl pyrophosphate) oxyacetate titanate, bis(dioctyl pyrophosphate) ethylene titante, isopropyltrioctanoyl titante, isoprpyldimethacrylisostearoyl titante, isopropyltridodecylbenzenesulfonyltitanate, isopropylisostearoyldiacryl titanate, isopropyltri(dioctyl phosphate) titanate, isopropyltricumylphenyl titanate and tetraisoprpylbis (dioctyl phosphite) titanate; and mixtures thereof.  
   
   
       10 . A method for forming an encapsulant composition comprising the step of combining: 
 a. an epoxy including at least two repeat siloxane units, and    b. a curing agent.    
   
   
       11 . A light emitting device comprised of a light emitting diode at least partially encapsulated by an epoxy composition including at least two repeat siloxane units.  
   
   
       12 . The device of  claim 11  wherein said epoxy composition includes between about 2 and about 15 repeat (H 3 C) 2  SiO units.  
   
   
       13 . The device of  claim 12  wherein said repeat units are substituted.  
   
   
       14 . The device of  claim 13  wherein said repeat units are substituted with functional groups selected from the group consisting of cycloaliphatic groups, cycloaliphatic epoxy groups, glycidoxy groups, and mixture thereof.  
   
   
       15 . The device of  claim 11  wherein said epoxy composition further comprises a curing agent selected from the group consisting of resins obtained by the condensation or co-condensation of phenols and naphthols with aldehydes, aralkyl phenolic resins, amines, amides, phenols, thiols, carboxylic acids, carboxylic anhydrides, and mixtures thereof.  
   
   
       16 . The device of  claim 11  wherein said epoxy composition further comprises a filler having a particle size below about 400 nm and selected from the group consisting of non-conductive carbon; powders of fused silica, crystalline silica, alumina, zircon, calcium silicate, calcium carbonate, silicon carbide, boron nitride, beryllia, zirconia; single-crystal fibers of potassium titanate, silicon carbide, silicon nitride, alumina; glass fibers; inorganic fillers having a flame retardant effect, and mixtures thereof.  
   
   
       17 . The device of  claim 11  wherein said epoxy composition further comprises a coupling agent.  
   
   
       18 . The device of  claim 17  wherein said coupling agent is selected from the group consisting of vinyltrichlorosilane, vinyltriethoxysilane, vinyltris(β-methoxyethyoxy) silane, γ-methacryloxypropyltrimethoxysilane, β-(3,4-epoxydicyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, vinlytriacetoxysilane, γ-mercaptopropyltirmethoxysilane, γ-aminopropyltriethoxysilane, γ-[bis-(β-hydroxyethyl)] amino-propyltriethoxysilane, N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, γ-(β-aminoethyl)aminopropyldimethoxymethylsilane, N-(trimethoxysiliylpropyl) ethylenediamine, N-(dimethoxysilylisopropyl)ethylenediamine, methyltrimethoxysilane, methyltriethoxysilane, n-β-(N-vinylbenzylaminoethyl)-γ-aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, hexamethyldisilane, γ-anilinopropyltrimethoxysilaen, vinyltrimethoxysilane and γ-mercaptopropylmethyldimethoxysilane, isopropyltriisosteroyl titanate, isopropyltris(diocyl pyrophosphate) titanate, isopropyltri(N-aminoethyl-aminoethyl)titanate, tetraoctylbis(ditridecyl phosphite) titanate, tetra(2,2-diallyloxymethyl-1-butyl)bis(ditridecyl)phophite titanate, bis(dioctyl pyrophosphate) oxyacetate titanate, bis(dioctyl pyrophosphate) ethylene titante, isopropyltrioctanoyl titante, isoprpyldimethacrylisostearoyl titante, isopropyltridodecylbenzenesulfonyltitanate, isopropylisostearoyldiacryl titanate, isopropyltri(dioctyl phosphate) titanate, isopropyltricumylphenyl titanate and tetraisoprpylbis (dioctyl phosphite) titanate; and mixtures thereof.  
   
   
       19 . The device of claim  111  further comprises a phosphor.  
   
   
       20 . A lamp comprised of a light emitting diode at least partially surrounded by an encapsulant composition comprised of an epoxy composition including greater than two siloxane repeat units.