Module for cooling semiconductor device

Abstract

A module for cooling a heat generating element comprising a heat receiving plate thermally connected to at least one heat generating element; a heat transfer device one end portion of which is thermally connected to the heat receiving plate and other end portion of which is thermally connected to a heat dissipating plate; a thermoelectric cooler one face of which is thermally connected to one face of the heat dissipating plate; a first heat sink thermally connected to other face of the heat dissipating plate; and a second heat sink thermally connected to other face of said thermoelectric cooler.

1 . A module for cooling a semiconductor element comprises a heat receiving/spreading device thermally connected to at least one heat generating element; a thermoelectric cooler thermally connected to said heat receiving/spreading device; a heat sink thermally connected to said thermoelectric cooler; and a heat pipe thermally connected to said heat receiving/spreading device to transfer a heat of said heat generating element in another direction, wherein the heat of said heat generating element is divided into at least two directions to be transferred and dissipated.  
   
   
       2 . The module for cooling a semiconductor element as claimed in  claim 1 , wherein another heat sink is thermally connected to other end of said heat pipe to transfer a main portion of heat from said heat generating element, while a remaining portion of the heat is transferred through said thermoelectric cooler.  
   
   
       3 . The module for cooling a semiconductor element as claimed in  claim 1 , wherein said heat sink comprises a first heat sink and a second heat sink, said first heat sink is thermally connected to said thermoelectric cooler, said second heat sink is installed above the first heat sink, other end of said heat pipe is thermally connected to said second heat sink, a main portion of heat from said heat generating element is transferred to said second heat sink by said heat pipe, and a remaining portion of the heat from said heat generating element is transferred to said first heat sink through said thermoelectric cooler.  
   
   
       4 . The module for cooling a semiconductor element as claimed in  claim 3 , wherein said heat pipe comprises a U-shaped round heat pipe having a prescribed elasticity, said thermoelectric cooler and said first heat sink are arranged to be sandwiched by said second heat sink and said heat receiving/spreading device to lower a contact heat resistance.  
   
   
       5 . The module for cooling a semiconductor element as claimed in  claim 4 , wherein a cooling fan is installed to said second heat sink.  
   
   
       6 . The module for cooling a semiconductor element as claimed in  claim 1 , wherein a soft metal foil as a thermal interface material is arranged between said heat receiving/spreading device and said thermoelectric cooler, as well as between said thermoelectric cooler and said heat sink, respectively.  
   
   
       7 . The module for cooling a semiconductor element as claimed in  claim 4 , wherein through holes are provided in corresponding prescribed positions in said heat receiving/spreading device, said thermoelectric cooler and said heat sink, respectively, and said heat receiving/spreading device, said thermoelectric cooler and said heat sink are fastened by corresponding screws.  
   
   
       8 . The module for cooling a semiconductor element as claimed in  claim 7 , wherein a fastening force is controlled so as to be a constant torque.  
   
   
       9 . The module for cooling a semiconductor element as claimed in  claim 7 , wherein a heat generated in said heat generating element is at least 100 W.  
   
   
       10 . The module for cooling a semiconductor element as claimed in  claim 2 , wherein another heat pipe is thermally connected to said heat receiving/spreading device to transfer a heat from another heat generating element to said heat receiving/spreading device.  
   
   
       11 . A module for cooling a heat generating element comprising a heat receiving plate thermally connected to at least one heat generating element; a heat transfer device one end portion of which is thermally connected to said heat receiving plate and other end portion of which is thermally connected to a heat dissipating plate; a thermoelectric cooler one face of which is thermally connected to one face of said heat dissipating plate; a first heat sink thermally connected to other face of said heat dissipating plate; and a second heat sink thermally connected to other face of said thermoelectric cooler.  
   
   
       12 . The module for cooling a heat generating element as claimed in  claim 11 , wherein said heat transfer device comprises a heat pipe.  
   
   
       13 . The module for cooling a heat generating element as claimed in  claim 11 , wherein said heat transfer device comprises a forcible circulation device to transfer heat by forcibly circulating a cooling medium.  
   
   
       14 . A module for cooling a heat generating element comprising a heat receiving/dissipating plate one face of one end portion of which is thermally connected to at least one heat generating element, one face of other end portion of which is thermally connected to one face of a thermoelectric cooler, other face of said other end portion of which is thermally connected to a first heat sink; and a second heat sink thermally connected to other face of said thermoelectric cooler.  
   
   
       15 . The module for cooling a heat generating element as claimed in  claim 12 , wherein said heat dissipating plate, said thermoelectric cooler, said first heat sink and said second heat sink are arranged so as to be substantially perpendicular to said heat receiving plate.  
   
   
       16 . The module for cooling a heat generating element as claimed in  claim 13 , wherein said heat dissipating plate, said thermoelectric cooler, said first heat sink and said second heat sink are arranged so as to be substantially perpendicular to said heat receiving plate.  
   
   
       17 . The module for cooling a heat generating element as claimed in  claim 12 , wherein said heat dissipating plate, said thermoelectric cooler, said first heat sink and said second heat sink are arranged so as to be substantially parallel to said heat receiving plate.  
   
   
       18 . The module for cooling a heat generating element as claimed in  claim 13 , wherein said heat dissipating plate, said thermoelectric cooler, said first heat sink and said second heat sink are arranged so as to be substantially parallel to said heat receiving plate.  
   
   
       19 . The module for cooling a heat generating element as claimed in  claim 15 , wherein a third heat sink is further thermally connected to said heat receiving plate.  
   
   
       20 . The module for cooling a heat generating element as claimed in  claim 16 , wherein a third heat sink is further thermally connected to said heat receiving plate.  
   
   
       21 . The module for cooling a heat generating element as claimed in claims  11 , wherein said first heat sink comprises said heat dissipating plate or said heat receiving/dissipating plate and a plurality of fin plates fixed thereon by crimping.  
   
   
       22 . The module for cooling a heat generating element as claimed in claims  11 , wherein said second heat sink comprises a base plate and a plurality of fin plates fixed on said base plate by crimping.  
   
   
       23 . The module for cooling a heat generating element as claimed in  claim 19 , wherein said third heat sink comprises said heat receiving plate and a plurality of fin plates fixed on said heat receiving plate by crimping.  
   
   
       24 . The module for cooling a heat generating element as claimed in  claim 11 , wherein said heat transfer device is fixed to said heat receiving plate by crimping.  
   
   
       25 . The module for cooling a heat generating element as claimed in  claim 11 , wherein said heat transfer device is fixed to said heat dissipating plate by crimping.  
   
   
       26 . The module for cooling a heat generating element as claimed in  claim 13 , wherein micro-channels are provided in said heat receiving plate, a working fluid boiled and evaporated in said micro-channels is moved to said heat dissipating plate in a state of vapor phase and condensed, and then the working fluid thus condensed circulates to said heat receiving plate by means of said forcible circulation device.